The Department of Commerce, specifically the National Institute of Standards and Technology (NIST), is conducting a sources sought notice to identify potential sources for a copper see-through wafer intended for scanning electron microscope (SEM)-based overlay metrology. The primary objective is to procure a 300 mm silicon wafer sample containing chips with specific copper damascene patterns that will facilitate research and development efforts aimed at enhancing the performance of SEM-based overlay metrology through physics-based simulations and artificial intelligence. This procurement is crucial for advancing integrated circuit production, which requires precise measurements of 3D structures. Interested vendors should respond to the notice by providing detailed information about their capabilities and products, including technical specifications and company details, to the primary contact, Jenna Bortner, at jenna.bortner@nist.gov, preferably before the specified deadline.