High-Performance 3D Digital Image Correlation (DIC) System
ID: NIST-SS26-CHIPS-46Type: Sources Sought
Overview

Buyer

COMMERCE, DEPARTMENT OFNATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGYDEPT OF COMMERCE NISTGAITHERSBURG, MD, 20899, USA

NAICS

Analytical Laboratory Instrument Manufacturing (334516)

PSC

LABORATORY EQUIPMENT AND SUPPLIES (6640)

Set Aside

No Set aside used (NONE)

Original Source

https://sam.gov/workspace/contract/opp/7494ffb0214e4df1a0f2d83d82d79426/view
Timeline
    Description

    The Department of Commerce, specifically the National Institute of Standards and Technology (NIST), is seeking information on potential sources for a High-Performance 3D Digital Image Correlation (DIC) System. This system is intended for precise, in-situ measurement of displacement and strain under various thermal and mechanical loading conditions, which is crucial for developing advanced testing methodologies and accurate failure prediction models in electronic packaging. The DIC system will play a vital role in addressing new failure mechanisms in 3D integrated devices, supporting the CHIPS Metrology program's objectives. Interested parties should contact Nina Lin at nina.lin@nist.gov for further details, and responses to this sources sought notice should be submitted promptly, as there is no solicitation available at this time.

    Point(s) of Contact
    Nina Lin
    nina.lin@nist.gov
    Files
    No associated files provided.
    Lifecycle
    Title
    Type
    High-Performance 3D Digital Image Correlation (DIC) System
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