The Department of Commerce, specifically the National Institute of Standards and Technology (NIST), is seeking information on potential sources for a High-Performance 3D Digital Image Correlation (DIC) System. This system is intended for precise, in-situ measurement of displacement and strain under various thermal and mechanical loading conditions, which is crucial for developing advanced testing methodologies and accurate failure prediction models in electronic packaging. The DIC system will play a vital role in addressing new failure mechanisms in 3D integrated devices, supporting the CHIPS Metrology program's objectives. Interested parties should contact Nina Lin at nina.lin@nist.gov for further details, and responses to this sources sought notice should be submitted promptly, as there is no solicitation available at this time.

The purpose of this sources sought notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government’s anticipated needs.

**BACKGROUND**

The National Institute of Standards and Technology (NIST), Gaithersburg 731.07 Group within the Engineering Laboratory is seeking a **High-Performance 3D Digital Image Correlation (DIC) System** capable of precise, *in-situ*, full-field displacement and strain measurement under various thermal and mechanical loading conditions. This system is critical for developing new multi-stress accelerated laboratory testing methodologies and acquiring the fundamental physical data required to develop accurate Finite Element Analysis (FEA)-based failure prediction models.

Current reliability practices are not equipped to address new failure mechanisms—such as cracking, melting, and interfacial debonding—induced by the increased localized heat production and mismatch of coefficients of thermal expansion (CTE) in 3D heterogeneously integrated devices. This DIC system will be used for *in-situ* monitoring of package and assembly deformation during service cycles to characterize the thermo-mechanical reliability of advanced electronic packaging, including measuring:

* Warpage and out-of-plane deformation during thermal cycling.
* Local strain accumulation due to CTE mismatch at material interfaces.
* Material and interfacial property changes under multiple simultaneous environmental stressors (temperature, moisture, and thermal cycling).

This work is in direct support of the CHIPS Metrology program (https://www.nist.gov/chips/research-development-programs/metrology-program), specifically addressing Grand Challenge 3: "Enabling Metrology for Integrating Components in Advanced Packaging."

NIST is seeking information from sources that may be capable of providing a solution that will achieve the objectives described above, in addition to the following essential requirements:

**I. System Configuration and Capabilities**

**A. Core 3D DIC System:**

1. **Measurement Principle:** Full-field, non-contact, high-resolution 3D Digital Image Correlation (DIC).
2. **Cameras:** Must include at least two high-resolution digital cameras (5.0 Megapixels or greater, monochrome preferred) synchronized for stereoscopic measurement.
3. **Lenses:** A set of interchangeable lenses must be provided to cover the required fields of view (see Section I.B).
4. **Accuracy (Out-of-Plane):** Must be capable of achieving an out-of-plane measurement sensitivity (Z-axis displacement) of **±15 µm** or better over the largest required Field of View (FOV). For small FOVs, accuracy must be **±0.5 µm** or better.
5. **Data Output:** Must provide full-field 3D displacement (U, V, W) and strain maps (εxx, εyy, εxy, Von Mises strain).
6. **Software:** Comprehensive software suite required for calibration, image acquisition, correlation processing, post-processing, and data export (including full raw data sets) for use as inputs for **FEA modeling** (e.g., ABAQUS).

**B. Fields of View (FOV) and Resolution:** The system must support dynamic switching or dual-camera setups to cover a wide range of component sizes, providing sufficient spatial resolution for sub-millimeter features while maintaining accuracy over large areas.

1. **Small FOV (Micro-scale):** Capable of measuring areas as small as **20 mm x 16 mm** with high magnification (suitable for individual packages, interconnects, or local strain analysis on critical materials: **Thermal Interface Materials (TIMs), Redistribution Layers (RDLs), and Underfills**).
2. **Mid FOV (Macro-scale):** Capable of measuring large Printed Circuit Board (PCB) or wafer sections up to **450 mm x 300 mm** (suitable for large assemblies and full wafers).

**C. Speckle-Free Measurement Capability:** The system **must** include the capability for *speckle-free* (or virtual speckle) measurement using a digital pattern projector

1. **Projector:** An integrated, high-contrast, high-resolution digital projector (LCD or similar) is required to project controlled, non-physical speckle patterns onto reflective or monotonic surfaces (like bare silicon wafers).
2. **Application:** This capability must enable accurate warpage measurement of mirror-like/shiny wafer surfaces or other sensitive samples where physical speckle application (paint/spray) is undesirable due to potential contamination or change in surface topography.

**II. Environmental Chambers (*In-Situ* Measurement)**

The system must include two distinct, integrated thermal/environmental chambers for high-precision, in-situ measurements, allowing the DIC system to capture images through viewing windows.

**A. Small-Sized Chamber (High-Magnification, Local Area):**

1. **Intended Use:** High-resolution measurement of small packages, interconnects, local CTE mismatch-induced strain, and the effect of **hygrothermal** (temperature and moisture) stress.
2. **Interior Volume:** Approximately **150 mm x 150 mm x 100 mm** (L x W x H) to minimize chamber size while accommodating fixtures.
3. **Temperature Range:** Ambient to **70 °C** (minimum). Specify details in response along with ramp rate.
4. **Humidity Range:** Must be capable of controlled humidity from **5% RH to 75% RH** (minimum) at temperatures up to 70 °C for hygrothermal reliability testing.
5. **Heating Rate:** Programmable heating and cooling rates compatible with **thermal cycling** (e.g., up to **10 °C/min**).
6. **Viewing:** Must include a high-optical-quality, distortion-free viewing window compatible with the small FOV lenses.

**B. Mid-Sized Chamber (Large Area, Wafer/PCB):**

1. **Intended Use:** Measurement of full 300mm wafer sections and large PCB assemblies.
2. **Interior Volume:** Must be large enough to comfortably accommodate a **450 mm x 300 mm** sample, with sufficient internal clearance for air circulation and mounting fixtures.
3. **Temperature Range:** Ambient to **70 °C** (minimum). Specify details in response along with ramp rate.
4. **Heating Rate:** Programmable heating and cooling rates suitable for large-scale thermo-mechanical testing.
5. **Viewing:** Must include a large, high-optical-quality, distortion-free viewing window compatible with the mid FOV lenses and providing sufficient separation for the stereoscopic camera setup.

**III. Supporting Features**

**A. Wire Port/Access:**

* Each chamber must include at least **two** pass-through ports (minimum **50 mm / 2 inches** in diameter each) to allow for monitoring cables, thermocouples, or electrical test wires to be fed through the oven, enabling simultaneous electrical monitoring during thermal loading.

**B. Data Acquisition and Control:**

* Indicate the number of internal sensors (temperature, humidity if applicable, etc.), their locations, and their accuracy.
* The system must include a mechanism for automated, precise image capture at specified temperature set-points or time intervals during thermal cycling.

**C. Lighting:**

* Provide details on the lighting system, including any specialized features (e.g., LED rings, diffused lighting, fiber optic illumination) required to ensure sufficient contrast on the speckle patterns within the environmental chambers, especially at elevated temperatures.

**HOW TO RESPOND TO THIS NOTICE**

In responding to this notice, please DO NOT PROVIDE PROPRIETARY INFORMATION. Please include only the following information, readable in either Microsoft Word 365, Microsoft Excel 365, or .pdf format, in the response:  Submit the response by email to the Primary Point of Contact and, if specified, to the Secondary Point of Contact listed in this notice as soon as possible, and preferably before the closing date and time of this notice.  Please note that to be considered for award under any official solicitation, the entity must be registered and “active” in SAM at the time of solicitation response.

* Provide the complete name of your company, address, name of contact for follow-up questions, their email, their phone number and, if your company has an active registration in https://sam.gov, your company’s Unique Entity ID (UEI).

* Identify the equipment that your company sells that can meet the objectives addressed in the BACKGROUND section of this notice.  For each product recommended to meet the Government’s requirement, provide the following:
  + Manufacturer name
  + Model number
  + Technical specifications
  + If your company is not the manufacturer, provide information on your company’s status as an authorized reseller of the product(s)

* Describe performance capabilities of the product(s) your company recommends to meet the Government’s requirements.  Additionally, if there are other features or functions that you believe would assist NIST in meeting its objectives described above, please discuss in your response.
  + Discuss whether the equipment that your company sells and which you describe in your response to this notice may be customized to specifications and indicate any limits to customization.

* Identify any aspects of the NIST market research notice, including instructions, and draft minimum specifications in the BACKGROUND section you cannot meet and state why.  Please offer suggestions for how the market research notice and draft minimum specifications could be made more competitive.

* State whether the proposed equipment is manufactured in the United States and, if not, state the name of the country where the equipment is manufactured.

* Identify any plans/possibilities for changes in manufacturing location of the aforementioned equipment and provide relevant details, including timeline.

* For the NAICS code listed in this notice:

* + Indicate whether your company is (a) a small business or (b) other than small business.  See the Table of Small Business Size Standards and the associated .pdf download file for small business size standards and additional information.

* + If you believe the NAICS code listed in this notice is not the best NAICS code for the type of product addressed in this notice, identify an alternative NAICS code that you believe would be more appropriate for the planned procurement.

* Describe services that are available with the purchase of the aforementioned equipment from your company such as installation, training, and equipment maintenance.

* Describe standard terms and conditions of sale offered by your company for the recommended equipment such as: delivery time after your company accepts the order; FOB shipping terms; manufacturer warranty (including details regarding nature and duration); if available, description(s) of available extended warranty; equipment setup and test; operator and service instruction manual(s); cleanup after installation; and if applicable, other offered services.  Provide a copy of manufacturer standard terms and conditions that typically relate to the sale of the specified equipment, if available.

* State whether your company offers facility renovation services related to installation of the recommended equipment at its delivery destination, if required per the NIST-identified minimum specifications, and provide description of said services.  Indicate if your company performs the facility renovation services or typically subcontracts the work to another company.  Indicate if your company would be interested in inspecting the intended installation site during the market research phase.

* State published price, discount, or rebate arrangements for recommended equipment and/or provide link to access company’s published prices for equipment and services.

* If the recommended equipment and related services are available for purchase on any existing Federal Supply Schedule contract(s) or other contracts against which NIST may be able to place orders, identify the contract number(s) and other relevant information.

* Identify any customers in the public or private sectors to which you provided the recommended or similar equipment.  Include customer(s) information: company name, phone number, point of contact, email address.

* Provide any other information that you believe would be valuable for NIST to know as part of its market research for this requirement.

* State if you require NIST to provide additional information to improve your understanding of the government’s requirement and/or would like to meet with NIST representatives to discuss the requirement and the capabilities of the identified equipment.

**QUESTIONS REGARDING THIS NOTICE**

Questions regarding this notice may be submitted via email to the Primary Point of Contact and the Secondary Point of Contact listed in this notice. Questions should be submitted so that they are received 5 calendar days prior to the response date. If the Contracting Officer determines that providing a written amendment to this notice to document question(s) received would benefit other potential respondents, the questions would be anonymized, and a written response to such question(s) would be provided via an amendment to this notice.

**IMPORTANT NOTES**

This notice is for market research purposes and should not be construed as a commitment by NIST to issue a solicitation or ultimately award a contract.  There is no solicitation available at this time.

This notice does not obligate the Government to award a contract or otherwise pay for the information provided in response.

NIST reserves the right to use information provided by respondents for any purpose deemed necessary and legally appropriate.

Any organization responding to this notice should ensure that its response is complete and sufficiently detailed to allow the Government to determine the organization’s capability.

Respondents are advised that the Government is under no obligation to acknowledge receipt of the information received or provide feedback to respondents with respect to any information submitted.

After a review of the responses received, a synopsis and solicitation may be published on GSA’s eBuy or SAM.gov. However, responses to this notice will not be considered an adequate response to any such solicitation(s).

The responses shall not exceed 10 pages including all attachments, charts, etc.

Thank you for taking the time to submit a response to this request!

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