Subscription Service: Market and Packaging Technology Trends
ID: NIST-SS25-CHIPS-00369Type: Sources Sought
Overview

Buyer

COMMERCE, DEPARTMENT OFNATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGYDEPT OF COMMERCE NISTGAITHERSBURG, MD, 20899, USA

NAICS

Other Scientific and Technical Consulting Services (541690)

PSC

SPECIAL STUDIES/ANALYSIS- SCIENTIFIC DATA (B529)

Original Source

https://sam.gov/opp/065c3182d57b4143bcd22f9fa99eccee/view
Timeline
  1. 1
    Posted Jan 15, 2025, 12:00 AM UTC
  2. 2
    Updated Jan 15, 2025, 12:00 AM UTC
  3. 3
    Due Jan 29, 2025, 4:00 PM UTC
Description

The National Institute of Standards and Technology (NIST) is seeking a subscription service focused on market and packaging technology trends to support its CHIPS Research and Development goals. This procurement aims to provide insights into semiconductor packaging technologies, including various chip packaging and assembly processes, to maintain competitiveness in the rapidly evolving electronics industry. The subscription will be awarded as a Sole Source to Techsearch International, Inc., and must include customer support, delivery, installation, warranty, and training, while adhering to federal cybersecurity and privacy standards. Interested parties can direct inquiries to Monica Brown at monica.brown@nist.gov or by phone at 301-975-0642, with responses encouraged to enhance small business participation.

Point(s) of Contact
Monica Brown
(301) 975-0642
monica.brown@nist.gov
Files
Title
Posted
Combined SSN NOI_NIST-SS25-CHIPS-00369.docx
Jan 15, 2025, 11:05 PM UTC
The National Institute of Standards and Technology (NIST) has issued a Combined Sources Sought Notice and Notice of Intent to Sole Source for a subscription service focused on market and packaging technology trends, particularly in semiconductor packaging. The aim is to support NIST's CHIPS Research and Development goals by maintaining competitiveness in the rapidly evolving electronics industry. The contract intends to award Techsearch International, Inc. a Sole Source based on identified needs for packaging technologies, including various types of chip packaging and assembly processes, accessible by ten subscribers under a corporate license. The subscription must include customer support, delivery, installation, warranty, and training, along with cybersecurity and privacy protections in compliance with federal standards. Respondents are invited to provide company details, capabilities, and any barriers that may limit participation in the procurement process. NIST encourages feedback that can enhance small business participation and assesses alternative NAICS codes relevant to the procurement. Questions regarding this notice can be submitted to the designated contact by a specified deadline. This notice serves as a preliminary market research tool, indicating that no contract award will occur immediately, nor are any decisions made yet. The document underlines the significance of security and privacy in handling sensitive information.
Lifecycle
Title
Type
Subscription Service: Market and Packaging Technology Trends
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