The National Institute of Standards and Technology (NIST) is seeking a subscription service focused on market and packaging technology trends to support its CHIPS Research and Development goals. This procurement aims to provide insights into semiconductor packaging technologies, including various chip packaging and assembly processes, to maintain competitiveness in the rapidly evolving electronics industry. The subscription will be awarded as a Sole Source to Techsearch International, Inc., and must include customer support, delivery, installation, warranty, and training, while adhering to federal cybersecurity and privacy standards. Interested parties can direct inquiries to Monica Brown at monica.brown@nist.gov or by phone at 301-975-0642, with responses encouraged to enhance small business participation.