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DIRECT TO PHASE II - Time Division Duplex (TDD) Radio Frequency (RF) Beamforming Chip for Active Electronically Scanned Array (AESA)
ID: N233-D10Type: BOTH
Overview

Topic

DIRECT TO PHASE II - Time Division Duplex (TDD) Radio Frequency (RF) Beamforming Chip for Active Electronically Scanned Array (AESA)

Agency

Department of DefenseN/A

Program

Type: SBIRPhase: BOTHYear: 2023

Additional Information

https://www.defensesbirsttr.mil/
Timeline
  1. 1
    Release Aug 23, 2023 12:00 AM
  2. 2
    Open Sep 20, 2023 12:00 AM
  3. 3
    Next Submission Due Oct 18, 2023 12:00 AM
  4. 4
    Close Oct 18, 2023 12:00 AM
Description

The Department of Defense (DoD) is seeking proposals for a research topic titled "DIRECT TO PHASE II - Time Division Duplex (TDD) Radio Frequency (RF) Beamforming Chip for Active Electronically Scanned Array (AESA)". The objective of this topic is to design and demonstrate a TDD RF beamforming chip that enables communication with existing and future Non-Geostationary Orbit (NGSO) satellite constellations using a single AESA antenna for both receive and transmit. The Navy is interested in developing a highly integrated semiconductor-based ASIC core TDD RF beamforming chip that provides beam steering, polarization tracking, Rx low noise amplification, and Tx power amplification. The chip should meet specific specifications such as dual-polarization antenna element support, half-duplex architecture, operational frequencies, noise figure, phase control, gain control, and more.

The project will be conducted in two phases. In Phase I, the small business must conduct a feasibility study and initial design of the TDD RF beamforming chip. The feasibility documentation must substantiate the scientific and technical merit, demonstrate proof of feasibility, and describe potential commercialization applications. Phase II involves designing, developing, demonstrating, and validating the affordable TDD RF beamforming chip. The small business must also develop an interface control document, life-cycle support strategies, per chip cost estimates, and a Phase III commercialization plan.

In Phase III, the prototype will be refined, and additional development may be performed to produce a Production Representative Article (PRA). Test and validation will be conducted to certify and qualify components for Navy use. The developed technologies may also be investigated for dual-use in other DoD applications and commercial applications such as satellite communication and cellular communication.

The project duration is not specified, but the proposal submission deadline is October 18, 2023. For more information and to access the solicitation, visit the DoD SBIR website at [solicitation_agency_url].

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