Thin-Film Lithium Niobate (TFLN) Photonic Chips
ID: AMD-RFQ-25-7700689Type: Combined Synopsis/Solicitation
Overview

Buyer

COMMERCE, DEPARTMENT OFNATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGYDEPT OF COMMERCE NISTGAITHERSBURG, MD, 20899, USA

NAICS

Semiconductor and Related Device Manufacturing (334413)

PSC

SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY (3670)

Original Source

https://sam.gov/opp/2444c96400934a5e8b0790502a653516/view
Timeline
    Description

    The National Institute of Standards and Technology (NIST) is soliciting quotations for the fabrication of Thin-Film Lithium Niobate (TFLN) photonic chips, which are crucial for their research in quantum communications and networking. The procurement aims to acquire at least seven custom-designed TFLN chips with specific optical and electronic features, requiring contractors to provide design resources and ensure timely fabrication within ten months of award. This initiative underscores NIST's commitment to advancing integrated optics technology, with a focus on enhancing capabilities in quantum measurement and optical state manipulation. Interested parties must submit their quotations by April 7, 2025, and direct inquiries to Collin Randall or Lauren P. Roller via email.

    Point(s) of Contact
    Collin Randall
    (301) 975-6728
    collin.randall@nist.gov
    Lauren P. Roller
    (301) 975-3062
    lauren.roller@nist.gov
    Files
    Title
    Posted
    Provisions Clauses.pdf
    This document outlines the provisions and clauses applicable to federal requests for proposals (RFPs) and grants, particularly emphasizing compliance with the Federal Acquisition Regulation (FAR). It includes a detailed compilation of required representations and certifications, such as those related to contracting with entities involved in covered telecommunications services, and those addressing certain liability regarding federal tax obligations and felony convictions. Key clauses dictate the need for offerors to verify their eligibility, provide certain disclosures, and ensure registration in the System for Award Management (SAM). The document further emphasizes various classifications of small businesses, including service-disabled veteran-owned and women-owned small businesses, detailing the specifics needed for proposal evaluations. Additionally, it mandates operational transparency regarding the use of internal confidentiality agreements that may restrict reporting of waste, fraud, or abuse. The structured framework serves to guarantee that contracting processes remain fair and compliant, fostering government accountability in procurement practices.
    Solicitation TFLN Final.pdf
    The National Institute of Standards and Technology (NIST) is soliciting quotations for the fabrication of Thin-Film Lithium Niobate (TFLN) photonic chips, which are essential for their research in quantum communications and networking. This Request for Quotation (RFQ No. AMD-RFQ-25-7700689) follows federal acquisition regulations and is open to both small and large businesses. The contractor must deliver the fabricated chips within ten months post-award, with delivery terms specified. Quotations should include a technical response outlining the proposed approach, fabrication capabilities, and corporate experience with similar projects. A price quotation must be provided, with a firm fixed price anticipated. The evaluation will focus on technical expertise, relevant corporate experience, and price, emphasizing the importance of the technical approach over cost. The document outlines clear requirements for submission formats, deadlines, and contact information for inquiries, reinforcing the structured nature of government procurement processes aimed at transparency and competitiveness. Overall, this RFQ underscores NIST’s commitment to advancing integrated optics technology within the context of public sector innovation and technological research.
    TFLN Chips Requirement.pdf
    The National Institute of Standards and Technology (NIST) intends to procure fabricated thin-film lithium niobate (TFLN) photonic chips for quantum communications research. The objective is to produce at least seven custom-designed TFLN chips fabricated on x-cut TFLN with specific thickness and component requirements, including optical and electronic features. The contractor must provide essential design resources and facilitate the successful design process, ensuring fabrication is completed within four months post-final design. The contract has a ten-month performance period, during which completed chips must be delivered within two weeks after fabrication to specified NIST locations. Inspection and acceptance terms stipulate that any defective or damaged products must be replaced at the contractor's expense. Payment follows Net 30-day terms upon receipt and acceptance of deliverables. This request reflects NIST's commitment to advancing technology in quantum measurement and optical state manipulation through integrated optics.
    Lifecycle
    Title
    Type
    Thin-Film Lithium Niobate (TFLN) Photonic Chips
    Currently viewing
    Combined Synopsis/Solicitation
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