Automated High Placement Accuracy Flip-Chip Die Bonder
ID: 1333ND24QNB030528Type: Combined Synopsis/Solicitation
Overview

Buyer

COMMERCE, DEPARTMENT OFNATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGYDEPT OF COMMERCE NISTGAITHERSBURG, MD, 20899, USA

NAICS

Semiconductor and Related Device Manufacturing (334413)

PSC

LABORATORY EQUIPMENT AND SUPPLIES (6640)

Set Aside

Total Small Business Set-Aside (FAR 19.5) (SBA)

Original Source

https://sam.gov/opp/a484aa8881bf4a2da51acbd1e6e14174/view
Timeline
    Description

    The National Institute of Standards and Technology (NIST) is seeking quotations for an Automated High Placement Accuracy Flip-Chip Die Bonder to support its Microsystems and Nanotechnology Division's research initiatives. The procurement aims to acquire a die bonder system capable of high-precision bonding for various semiconductor surfaces, essential for advancing measurement science and improving semiconductor integration techniques. This equipment will be utilized in a class 100 cleanroom environment, requiring stringent specifications for operational capabilities, including alignment accuracy of one micron or less. Interested contractors must submit their quotations by 12:00 PM EST on October 31, 2024, and ensure active registration in the System for Award Management (SAM). For further inquiries, contact Sadaf Afkhami at Sadaf.Afkhami@nist.gov or call 301-975-3976.

    Point(s) of Contact
    Sadaf Afkhami
    (301) 975-3976
    Sadaf.Afkhami@nist.gov
    Files
    Title
    Posted
    Atatchment 1- Statement of Requirement.pdf
    The National Institute of Standards and Technology (NIST) seeks to procure an automated flip-chip die bonder system for its Center for Nanoscale Science and Technology cleanroom in Gaithersburg, MD. This cutting-edge equipment will enhance NIST's research capabilities in the semiconductor supply chain and advanced packaging. The system must offer high placement and alignment accuracy, cleanroom compatibility, and automated operation while adhering to strict technical specifications. Additionally, the vendor will provide installation, training, and a one-year warranty, with options for extended warranties and maintenance services. The successful bidder will deliver the system, including all required accessories, within a specified timeline, ensuring a seamless integration into NIST's research environment.
    Atatchment 1- Statement of Requirement (Revised).pdf
    The National Institute of Standards and Technology (NIST) seeks to procure an Automated High Placement Accuracy Flip-Chip Die Bonder for its Center for Nanoscale Science and Technology in Gaithersburg, MD. This equipment will enhance research into semiconductor bonding techniques, addressing inefficiencies in current methodologies. The die bonder must operate in a class 100 cleanroom environment and support manual to fully automatic processes with precise temperature, force, and timing controls. Key specifications include a placement accuracy of one micron or less, capabilities for heating substrates, and features for automated alignment and process recording. The purchase includes delivery, installation, and training for new users, along with options for extended warranty and maintenance services. The document outlines thorough technical requirements, installation and training timelines, and strict conditions for safety, security, and documentation to ensure adherence to regulatory standards. Overall, this initiative demonstrates NIST's commitment to advancing metrology in semiconductor fabrication, enhancing the understanding and development of microelectronics and photonics technologies.
    Attachment 1- Statement of Requirement (Revised 10.15.24).pdf
    The National Institute of Standards and Technology (NIST) is issuing a Request for Proposal (RFP) for an automated flip-chip die bonder intended for advanced semiconductor packaging. As part of its Microsystems and Nanotechnology Division’s research, the die bonder will be essential for conducting experimental investigations into the bonding of various semiconductor surfaces under controlled conditions. The requested equipment must support a class 100 cleanroom environment and allow for high-precision bonding, featuring accuracy of one micron or less. The scope of the proposal stipulates the delivery, installation, and training on the die bonder within a specific timeline, requiring that the equipment meet numerous technical specifications, including precise control of parameters like temperature and force. Additionally, the proposal outlines warranty and maintenance options, with criteria for the system’s design to enhance operational efficiency and minimize contamination risks. The document provides detailed requirements for the equipment’s mechanics, heating capabilities, alignment, bonding force range, process recording, and operational software. The end goal is to advance NIST’s measurement science to better understand and improve semiconductor integration techniques, thereby addressing market supply chain needs and fostering innovation in chip manufacturing.
    Attachment 2- Provisions and Clauses.pdf
    The document outlines essential provisions and clauses incorporated into a government solicitation, highlighting compliance requirements for contractors submitting offers. Key provisions include the necessity for vendors to use the System for Award Management (SAM) and to disclose information regarding telecommunications equipment and services, ensuring no use of covered technologies as defined by the John S. McCain NDAA. Additional representations address tax liability, felony convictions, affirmative action compliance, and trade agreements, emphasizing transparency and accountability in government contracting. Contractors must also certify their capabilities and compliance with various regulations, including prohibitions against engaging with entities tied to certain telecommunications equipment. The document specifies procedures for agency protests and the expectations for invoicing and contract execution, including how contractors should handle performance during NIST operating status changes. Overall, it establishes a framework for ensuring that procurement processes align with federal compliance standards, thus safeguarding integrity in government contracting while promoting accountability among bidders.
    Combined Synopsis-Solicitation.pdf
    The document is a solicitation issued by the National Institute of Standards and Technology (NIST) for an Automated High Placement Accuracy Flip-Chip Die Bonder under solicitation number 1333ND24QNB030528. The request seeks firm-fixed-price quotations for the die bonder system, related tooling, and warranty options. The procurement falls under NAICS code 334413, emphasizing full and open competition and requiring contractors to maintain active registration in the System for Award Management (SAM). The contract aims to support NIST's Microsystems and Nanotechnology Division (MND) in the development and characterization of integrated microsystems within a cleanroom. Responses must include separate electronic files detailing the technical capability, past performance, price quotation, and compliance with provisions and clauses. Evaluation criteria prioritize technical capability, past performance, and price, with emphasis on the technical aspects. Contractors must provide evidence of meeting stringent specifications, including alignment accuracy and operational capabilities, which are crucial for advanced microelectronic and photonic device integrations. The due date for quotations and questions is August 30, 2024, with a specific emphasis on following the outlined submission format and evaluation criteria. Attachments include a detailed Statement of Requirements and provisions and clauses pertinent to the solicitation.
    Lifecycle
    Title
    Type
    Automated High Placement Accuracy Flip-Chip Die Bonder
    Currently viewing
    Combined Synopsis/Solicitation
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