Planar Junction Deposition System
ID: NB6720602500012Type: Combined Synopsis/Solicitation
Overview

Buyer

COMMERCE, DEPARTMENT OFNATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGYDEPT OF COMMERCE NISTGAITHERSBURG, MD, 20899, USA

NAICS

Semiconductor Machinery Manufacturing (333242)

PSC

ELECTRICAL AND ELECTRONIC PROPERTIES MEASURING AND TESTING INSTRUMENTS (6625)
Timeline
    Description

    The Department of Commerce, specifically the National Institute of Standards and Technology (NIST), is seeking proposals for a Planar Junction Deposition System to enhance its Boulder Micro-fabrication Facility's capabilities. The procurement aims to modernize existing deposition technologies critical for superconducting electronics, requiring the contractor to supply, install, and train users on the new system while ensuring compliance with ISO Class 5 cleanroom standards. This advanced semiconductor machinery is vital for research and development in superconductive electronics, with a focus on technical capabilities and relevant experience during the evaluation process. Interested contractors should contact Lia M. Arthofer at lia.arthofer@nist.gov or 303-497-3870 for further details, and must submit their proposals in accordance with the outlined requirements and deadlines specified in the RFQ documents.

    Point(s) of Contact
    Files
    Title
    Posted
    The document is a combined synopsis/solicitation (RFQ) for a Planar Junction Deposition System by the National Institute of Standards and Technology (NIST). It outlines the requirement for this semiconductor machinery, including installation and training services. The solicitation (NB672060-25-00012) follows FAR 13.5 and has an unrestricted basis, concentrating on technical capabilities, relevant experience, and pricing. Offerors must submit technical proposals, prior experience, separate price quotations, and terms and conditions within the specified format and deadlines. A key requirement is demonstration of capability to meet the Statement of Work (SOW), and evidence of prior successful installations of similar systems, especially for multi-cathode co-sputtering. Price quotations must be firm-fixed-price and include all associated shipping costs. The government emphasizes that technical capability and experience are weighted more heavily than price in the evaluation process, with a likelihood of awarding a single purchase order. The solicitation requires adherence to various FAR clauses and mandates submission through an electronic format. Accessibility, compliance with tax regulations, and potential disruptions from government operating status changes are additional considerations outlined for contractors. Overall, the RFQ indicates the government's intention to procure specialized machinery with a strong focus on qualifications and experience.
    The document outlines a Request for Proposal (RFP) for a new Planar Junction Deposition System for the Communications Technology Laboratory's Boulder Micro-fabrication Facility (BMF) at NIST-Boulder. This project aims to modernize the existing deposition capabilities critical for various superconducting electronics and related applications. The contractor is required to supply, install, and train users on this innovative system, ensuring compatibility with ISO Class 5 cleanroom standards and the ability to replicate existing processes. Key tasks include providing detailed technical specifications, proof of prior experience, a comprehensive support proposal, and guarantees of system performance through factory acceptance tests prior to shipment. Responsibilities are assigned between the contractor and the government, including an extensive list of system requirements that cover operation, control, safety, and performance metrics. The overall goal is to enhance research capabilities in superconductive electronics while maintaining rigorous standards of safety and compliance, culminating in a functional and efficient deposition system tailored to specific scientific needs at NIST.
    The document presents dimensions relevant to existing equipment installation, specifically focusing on walls and available footprints in a structural context. Key measurements include a wall height of 7 feet and a width of 3 feet, alongside an available footprint of 9 feet by 3 feet. The data is formatted in a tabular style, highlighting the coordinated parameters necessary for project development. This information is critical for properly planning infrastructure installations in response to government RFPs, federal grants, or state/local requests for proposals, ensuring compliance with physical space requirements. The concise format aids stakeholders in visualizing and assessing the physical constraints and opportunities for potential projects.
    The RFQ Attachment 4 outlines the Relevant Experience Project Data Sheet for companies responding to government RFPs. The document serves to collect essential information about an offeror's experience, including details such as the firm name, contact information, work performed, and type of contract. It requires the contractor to indicate their role (prime contractor, subcontractor, etc.), the percentage of work completed, and the relevant project details like contract number, award amount, and completion dates. A key section demands a detailed description of the project, highlighting its relevance to the current RFP requirements. The structure is organized into specific sections designed to ensure all necessary information is gathered clearly and concisely while adhering to a limit of one double-sided page. This document is vital for government agencies to assess the qualifications and experience of potential contractors, ensuring that only capable firms are considered for federal projects. Its systematic approach facilitates efficient evaluation and comparison during the procurement process.
    Lifecycle
    Title
    Type
    Combined Synopsis/Solicitation
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