The Department of Commerce, specifically the National Institute of Standards and Technology (NIST), intends to noncompetitively acquire 200 Advanced Test Vehicles to study the reliability of materials used in the advanced packaging of semiconductor chips. This procurement is part of the CHIPS Metrology program, focusing on the evaluation of polymeric components such as underfill epoxies and thermal interface materials, with specific requirements for design capabilities, embedded sensors, and modular testing processes. The acquisition is justified under FAR 13.106-1(b), following market research that identified The Research Foundation for The State University of New York as the only suitable provider. Interested parties are encouraged to respond with their capabilities to potentially compete for this contract, and inquiries can be directed to Nina Lin at nina.lin@nist.gov or Donald Collie at donald.collie@nist.gov.