FlipChip Bonding
ID: SLAC_354410_FlipchipbondingType: Solicitation
Overview

Buyer

ENERGY, DEPARTMENT OFENERGY, DEPARTMENT OFSLAC Natl Accel Lab -DOE ContractorMenlo Park, CA, 94025, USA

NAICS

Other Electronic Component Manufacturing (334419)

PSC

GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCH (AJ12)

Original Source

https://sam.gov/opp/b0fd0720fd854a20905d9ed743b0b664/view
Timeline
    Description

    The SLAC National Accelerator Laboratory, operated by Stanford University for the Department of Energy, is seeking quotations for the procurement of flip-chip bonding services for various integrated circuit and sensor wafers. The requirement includes the production of 120 modules in different configurations, with specific technical criteria such as bump-to-bump pitch, lithography capabilities, and flip-chip bonding specifications outlined in the Statement of Work (SOW). This procurement supports advanced detector technologies critical for high-energy physics research, reflecting the laboratory's commitment to scientific infrastructure. Interested vendors must submit their best and final offers by April 24, 2025, and direct inquiries to Katherine Jill A. Coh at kcoh@slac.stanford.edu or by phone at 650-926-2770.

    Point(s) of Contact
    Katherine Jill A. Coh
    (650) 926-2770
    kcoh@slac.stanford.edu
    Files
    Title
    Posted
    01. BAA_Certification_08.29.2023_(D5) (1).pdf
    The Buy America Act Certification document is a critical component for bidders or offerors participating in federal, state, or local Requests for Proposals (RFPs). It requires the offeror to certify, through a straightforward checklist, whether each end product qualifies as a U.S. domestic commercial product. If a product does not meet this criterion, the offeror must disclose any excluded end products and provide information on the percentage of foreign content in the item or service being procured, along with the country of origin. This certification aims to ensure compliance with the Buy American Act provisions, which emphasize the preference for American-made products in government contracts. The document includes sections for the offeror’s signature, printed name, title, and company name, thereby formalizing the commitment to these representations. Overall, the certification serves as an essential mechanism for promoting domestic industry and safeguarding U.S. manufacturing standards in government procurement processes.
    A1.B_SOW-UHR-15wafers.pdf
    The procurement document outlines the requirements for processing and bonding integrated circuit and sensor wafers to create focal-plane modules for the SLAC National Accelerator Laboratory. The lab will supply specific quantities of integrated-circuit wafers and silicon sensor wafers, along with their layouts. The vendor's responsibilities include producing photomask sets, applying a passivation layer, under bump metallization, and forming solder bumps on the wafers. Furthermore, the vendor will perform dicing of both the ROC and sensor wafers and execute flip-chip bonding for various module geometries. A total of 120 modules in different configurations will be produced, and all completed assemblies must be packaged securely. Unused wafer parts and chips must be returned to SLAC, indicating a strict expectation for accountability and material management. This procurement aims to support advanced detector technologies used in high-energy physics research, reflecting the laboratory’s research focus and investment in critical scientific infrastructure.
    Fixed_Price_Commercial_Supplies_and_Services_Subcontract_Aug2023.pdf
    The document outlines the General Terms and Conditions for Fixed Price Commercial Supplies and Services between the Buyer, represented by the Board of Trustees of Stanford University and SLAC National Accelerator Laboratory, and the Seller, who provides materials and services. Key provisions include the definition of terms, the scope of the Subcontract, Seller responsibilities, and regulations concerning payment and delivery. It emphasizes the need for compliance with federal laws, including procurement guidelines, and stipulates Seller obligations regarding quality assurance, inspections, and warranties. Moreover, it specifies the limits of liability, the process for dispute resolution, and confidentiality agreements. Additionally, it includes clauses that incorporate relevant federal regulations that must be adhered to based on contract value. This document serves as a framework ensuring both parties understand their roles, responsibilities, and legal obligations in the procurement process, thus aiding in the effective management of government contracts and grants.
    Lifecycle
    Title
    Type
    FlipChip Bonding
    Currently viewing
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