Wafer Grinder and CMP Tools
ID: N0017325RFIMB08Type: Sources Sought
Overview

Buyer

DEPT OF DEFENSEDEPT OF THE NAVYNAVAL RESEARCH LABORATORYWASHINGTON, DC, 20375-5328, USA

NAICS

Semiconductor Machinery Manufacturing (333242)

PSC

SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY (3670)

Original Source

https://sam.gov/opp/8e013cc8ca614924bbee35fd448d25fa/view
Timeline
    Description

    The Department of Defense, through the Naval Research Laboratory (NRL), is seeking sources for commercially available wafer grinder and chemical mechanical polishing (CMP) tools as outlined in Sources Sought Notice N0017325RFIMB08. The procurement aims to acquire equipment capable of efficiently grinding and polishing semiconductor substrates, specifically for wafer diameters ranging from 75 mm to 150 mm, with stringent requirements for minimal total thickness variation, accurate thickness measurements, and low surface roughness. This initiative is crucial for advancing semiconductor manufacturing technology, ensuring precise and reliable equipment procurement. Interested vendors must submit a capability statement by January 14, 2025, detailing their technical capabilities and past performance, with inquiries directed to Michael Broomfield at michael.h.broomfield.civ@us.navy.mil or by phone at 202-875-9785.

    Point(s) of Contact
    Michael Broomfield
    (202) 875-9785
    michael.h.broomfield.civ@us.navy.mil
    Files
    Title
    Posted
    Grinder and CMP Tool Specifications_December_18_2024.pdf
    The government document outlines specifications for a Wafer Grinder and Chemical Mechanical Polisher (CMP) tool as part of Code 6880. The tools must efficiently grind and polish semiconductor substrates, specifically supporting wafer diameters of 75 mm to 150 mm. Key requirements include the grinding system's capability to achieve minimal total thickness variation (TTV), accurate thickness measurements, and low surface roughness following the CMP process. Demonstrations of specific wafer stack processing, edge chip elimination, and consistent wafer thickness are necessary. Additionally, the grinder is required to perform manual loading, implement air bearings, and feature a filtration system for wastewater. The CMP system must effectively deliver and clean slurry from the polishing pads, featuring programmable pad conditioning and a vacuum system for wafer transfer. Contractors must provide on-site installation, training, and a minimum 12-month warranty on system components. This document serves as a formal request for proposals (RFP) from potential contractors, indicating the government's commitment to advancing semiconductor manufacturing technology through precise and reliable equipment procurement.
    N0017325RFIMB08_waferginderCMPtools.pdf
    The Naval Research Laboratory (NRL) has issued a Sources Sought Notice (RFI): N0017325RFIMB08 for commercially available wafer grinder and chemical mechanical polishing (CMP) tools. The purpose of this RFI, posted on January 3, 2025, is to assess industry interest and identify potential sources that can meet specific equipment requirements outlined in an attached document. The NRL seeks responses from all responsible parties by January 14, 2025, emphasizing that the notice serves only for market research and does not imply any future contract commitment or solicitation. Interested vendors must submit a capability statement detailing contact information, technical capabilities, product descriptions, and relevant past performance in no more than ten pages. The document underlines that responses will be evaluated for possible future procurement but does not guarantee an award. The point of contact for this notice is Michael Broomfield. Interested parties are instructed to reference the RFI number in all correspondence.
    Lifecycle
    Title
    Type
    Wafer Grinder and CMP Tools
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