The Department of Commerce, specifically the National Institute of Standards and Technology (NIST), intends to noncompetitively acquire a CHIPS Atomic Force Microscopy (AFM) Thermocouple Scanning Thermal Microscopy (SThM) module. This acquisition aims to enhance the Nanoscale Mechanical Properties Group's capabilities in measuring local variations in temperature and thermal conductivity at the nanoscale, which is critical for advancing semiconductor manufacturing and supporting the CHIPS Metrology Program. The module is essential for mapping thermal mechanical properties of materials used in advanced packaging, thereby contributing to innovation and improved reliability in the semiconductor industry. Interested parties that believe they can meet NIST's requirements are encouraged to respond with their capabilities and relevant information by contacting Tracy Retterer at tracy.retterer@nist.gov or Forest Crumpler at forest.crumpler@nist.gov.