Photonic Bump Bonds

The Department of Defense, specifically the Navy, is seeking innovative solutions through the STTR program for the development of "Photonic Bump Bonds," aimed at enhancing the performance of heterogeneous photonic integrated circuits (PICs). The primary objective is to create a technique that enables the vertical output of optical beams from planar photonic devices, facilitating 3D packaging and integration of high-performance chiplets. This technology is crucial for advancing RF photonic circuits, allowing for improved functionality and reduced insertion losses, which are essential for military applications. The opportunity is currently in the pre-release phase, with an open date set for January 8, 2025, and a close date of February 5, 2025. Interested parties can find more information and submit proposals through the official DOD SBIR/STTR website.