FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
ID: 352662Type: Posted
Overview

Buyer

National Institute of Standards and Technology (DOC-NIST)

Eligible Applicants

Others

Funding Category

Science and Technology and other Research and Development

Funding Instrument

Other

Opportunity Category

Discretionary

Cost Sharing or Matching Requirement

Yes

Original Source

https://grants.gov/search-results-detail/352662
Timeline
  1. 1
    Forecast Posted Not available
  2. 2
    Forecast Due Not available
  3. 3
    Posted Feb 28, 2024 12:00 AM
  4. 4
    Due Jul 3, 2024 12:00 AM
Description

The National Institute of Standards and Technology is offering a federal grant opportunity titled "FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates". This program aims to advance the development of semiconductor technologies and enhance the competitiveness of the U.S. semiconductor industry. The grant seeks applications for new research and development activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, which are key technologies for producing microelectronics systems. Eligible applicants include domestic for-profit and non-profit organizations, accredited domestic institutions of higher education, and state, local, territorial, and Indian tribal governments. The deadline for submission is July 3, 2024. For more information, contact Misty L Roosa, a Management Analyst at grants@nist.gov.

Point(s) of Contact
grants@nist.gov
Files
Title
Posted
CHIPS NAPMP MATERIALS AND SUBSTRATES NOFO.pdf
4/10/2024
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