FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
ID: 352662Type: Posted
Overview

Buyer

National Institute of Standards and Technology (DOC-NIST)

Eligible Applicants

Others

Funding Category

Science and Technology and other Research and Development

Funding Instrument

Other

Opportunity Category

Discretionary

Cost Sharing or Matching Requirement

Yes

Original Source

https://grants.gov/search-results-detail/352662
Timeline
  1. 1
    Forecast Posted Not available
  2. 2
    Forecast Due Not available
  3. 3
    Posted Feb 28, 2024, 12:00 AM UTC
  4. 4
    Due Jul 3, 2024, 12:00 AM UTC
Description

The National Institute of Standards and Technology (NIST) is offering a funding opportunity through the FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) aimed at enhancing domestic research and development of advanced packaging materials and substrates for semiconductor technologies. This initiative seeks applications that will establish and accelerate domestic capacity in this critical area, with a focus on transitioning innovations into manufacturing and fostering a skilled workforce. Approximately $300 million will be awarded across multiple grants, with individual awards of up to $100 million over five years, and key deadlines include a webinar on March 1, 2024, and concept paper submissions due by April 12, 2024. Interested applicants can reach out to Misty L Roosa at grants@nist.gov for further information.

Point(s) of Contact
grants@nist.gov
Files
Title
Posted
CHIPS NAPMP MATERIALS AND SUBSTRATES NOFO.pdf
Apr 10, 2024, 12:30 PM UTC
CHIPS.pdf
Aug 24, 2024, 2:22 AM UTC
The National Advanced Packaging Manufacturing Program (NAPMP) under the National Institute of Standards and Technology (NIST) is launching a funding opportunity aimed at enhancing domestic research and development of advanced packaging materials and substrates for semiconductor technologies. This initiative, funded through the CHIPS for America program, seeks applications that align with its objectives: advancing R&D, transitioning innovations into manufacturing, developing a domestic capacity for materials and substrates, and fostering a skilled workforce. Funding of approximately $300 million will be awarded across multiple grants, with individual awards up to $100 million over five years. Eligible applicants include for-profit organizations, non-profits, educational institutions, and governments. A structured project plan divided into four phases will be required, with each phase focusing on technical advancement, workforce education, and commercial viability. Key dates include a webinar on March 1, 2024, for guidance and a deadline for concept paper submissions by April 12, 2024. This initiative emphasizes inclusivity, environmental responsibility, and significant commercial potential while aiming to establish resilient semiconductor supply chains in the U.S.
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