FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

Active
Yes
Status
Posted
Published Date
February 28th, 2024
Close Date
July 3rd, 2024
Opportunity No.
2024-NIST-CHIPS-NAPMP-01

Agency

National Institute of Standards and Technology (DOC-NIST)

Eligible Applicants

Others

Funding Category

Science and Technology and other Research and Development

Funding Instrument

Other

Opportunity Category

Discretionary

Cost Sharing or Matching Requirement

Yes

Summary

The National Institute of Standards and Technology is offering a federal grant opportunity titled "FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates". This program aims to advance the development of semiconductor technologies and enhance the competitiveness of the U.S. semiconductor industry. The grant seeks applications for new research and development activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, which are key technologies for producing microelectronics systems. Eligible applicants include domestic for-profit and non-profit organizations, accredited domestic institutions of higher education, and state, local, territorial, and Indian tribal governments. The deadline for submission is July 3, 2024. For more information, contact Misty L Roosa, a Management Analyst at grants@nist.gov.

Description

The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.

Contact Information

Attachments
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Opportunity Lifecycle

Title
Type
Grant

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