Micro specimens of thin film electroplated copper and micro-sized lead-free solder for mechanical testing to fracture
ID: NIST-SS25-21Type: Sources Sought
Overview

Buyer

COMMERCE, DEPARTMENT OFNATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGYDEPT OF COMMERCE NISTGAITHERSBURG, MD, 20899, USA

NAICS

Scientific Research and Development Services (5417)

PSC

GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCH (AJ12)

Original Source

https://sam.gov/opp/8c02511aff3c4a43b852ed42e9a14c6a/view
Timeline
    Description

    The Department of Commerce, specifically the National Institute of Standards and Technology (NIST), is seeking a research and development partner to fabricate micro-sized specimens of electroplated copper and lead-free solder for mechanical testing. The objective is to develop metrology for measuring micromechanical properties to fracture, addressing the current lack of reliable data due to discrepancies in size scale and microstructure. These materials are crucial for advanced packaging interconnect technologies, particularly in heterogeneous integration. Interested parties should contact Cielo Ibarra at cielo.ibarra@nist.gov to express their qualifications and capabilities, as this notice serves as a precursor to a potential solicitation for future procurements, without any commitment from NIST to issue a contract.

    Point(s) of Contact
    Cielo Ibarra
    cielo.ibarra@nist.gov
    Files
    Title
    Posted
    SSN.docx
    The NIST Sources Sought Notice (NIST-SS25-21) seeks a research and development partner to fabricate micro-sized specimens of electroplated copper and lead-free solder for mechanical testing. These materials are essential for advanced packaging interconnect technologies, particularly in heterogeneous integration. NIST aims to develop metrology to measure micromechanical properties to fracture for these materials, which currently have a lack of reliable data due to discrepancies in size scale and microstructure. The contractor must produce freestanding specimens with specific thicknesses and geometries tailored to industry standards and perform various mechanical tests, including tensile and fatigue tests. The contractor is also required to have extensive cleanroom fabrication and materials characterization capabilities, along with significant experience in microfabrication and semiconductor packaging R&D. Additionally, the contractor will train NIST employees to perform fabrication processes and provide all methodologies and results collaboratively. Interested parties are encouraged to respond with their qualifications, capabilities, and insights into the R&D process, while ensuring no proprietary information is shared. This notice acts as a precursor to a potential solicitation for future procurements, although it does not commit NIST to issue a contract.
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