Materials for High-Temperature Performance Electronics: Memory and Packaging
ID: AF233-D012Type: BOTH
Overview

Topic

Materials for High-Temperature Performance Electronics: Memory and Packaging

Agency

Department of DefenseN/A

Program

Type: SBIRPhase: BOTHYear: 2023

Topic Link

https://www.sbir.gov/node/2447987

Additional Information

https://www.defensesbirsttr.mil/
Timeline
  1. 1
    Release Aug 23, 2023 12:00 AM
  2. 2
    Open Sep 20, 2023 12:00 AM
  3. 3
    Next Submission Due Oct 18, 2023 12:00 AM
  4. 4
    Close Oct 18, 2023 12:00 AM
Description

The Department of Defense (DoD) is seeking proposals for the development of materials, devices/subcomponents, and integration processes that will enable a fully functional microprocessor capable of continuous operation at elevated temperatures. The goal is to develop materials and components capable of operation above 500 degrees Celsius to be used in Department of the Air Force platforms subject to extreme temperatures during operations. The topic is expected to deliver at least two lab-scale testbeds of fully packaged electronics capable of operating at temperatures of at least 400 degrees Celsius (up to 500 degrees Celsius desired) without detrimental loss to functionality. The Phase I award is not required, and the offeror should provide detail and documentation in the Direct to Phase II proposal, demonstrating accomplishment of a "Phase I-type" effort, including a feasibility study. The Phase II effort will focus on developing the technical approach, product, or process and conducting relevant demonstrations. The contractor will establish a research and development strategy to address key technical hurdles in scalable memory fabrication and integration, transistor fabrication and integration, and subcomponent integration. The final deliverable will consist of one or more prototype devices with demonstrated continuous operation at elevated temperature. The contractor will also pursue commercialization of the developed technologies for transitioning expanded mission capability to a broad range of potential government and civilian users.

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