DOD SBIR 24.4 Annual

DOD SBIR 24.4 Annual - Biometrics for Multi Factor Authentication

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Department of Defense

The Department of Defense (DOD) is seeking proposals for the topic "Biometrics for Multi Factor Authentication" as part of their SBIR 24.4 Annual solicitation. The specific branch for this topic is the Army, and the topic number is A244-008. The objective of this solicitation is to develop dual-band Mid-wave Infrared/Long-Wave Infrared (MWIR/LWIR) Infrared Focal Plane Array (IR FPA) technology that can meet Third Generation Forward Looking Infrared (3GEN FLIR) performance objectives. This technology will benefit all forms of Army and DOD night vision sensors, including individual soldier, ground vehicle, unmanned vehicles, and aircraft. The combination of MWIR & LWIR imaging increases the ability to penetrate fog and dust clouds and provides resilience against stray light artifacts from bright sources. The project will focus on the use of Antimonide-based strained layer superlattices (SLS) as a cost-effective and high yield detector material for dual-band FPAs. The project will be conducted in phases, with Phase I accepting Direct to Phase II (DP2) proposals. Phase II will involve the fabrication of MWIR/LWIR dual-band SLS FPAs that meet 3GEN FLIR performance objectives. The project also has potential dual-use applications in areas such as enhanced vision for emergency response, earth observation, autonomous driving, maritime navigation, and security systems. The project duration is not specified, and funding specifics can be found on the grants.gov website. For more information and to submit a proposal, visit the SBIR topic link provided.

DOD SBIR 24.4 Annual - Lightweight Longwave Bolometer Sensor Components

Active

Department of Defense

The Department of Defense (DOD) is seeking proposals for the topic "Lightweight Longwave Bolometer Sensor Components" as part of the SBIR program. The objective of this topic is to develop components that enable low size, weight, and power (SWAP) thermal bolometer-type longwave thermal sensor payloads. These components should have equal or better performance than current commercial offerings while driving down SWAP. The components of interest include lens, focal plane, and readout and processing embedded hardware. The components should be ready for integration into a camera module by the end of Phase II. Thermal longwave infrared (LWIR) capabilities are crucial for many Army applications, especially for small Unmanned Aircraft Systems (UAS). However, the size, power, and weight constraints often limit the performance of these sensors. This topic aims to develop components that reduce the weight of thermal payloads while increasing their capabilities and keeping unit costs low. The project will have a Phase I and Phase II, with Phase I proposals accepting a cost of up to $250,000 for a 6-month period of performance. During Phase I, firms should design a proposed component with stakeholder input, analyze the SWAP-C impact of the component, and discuss how it will support the objective sensor payload. Phase II will involve completing the component design, fabricating, testing, and characterizing the component for integration into a lightweight sensor payload. Firms will also refine the design, define relevant interfaces, and lay out a high-level plan for integration. The potential applications of this research include smartphone camera augmentation, UAV camera augmentation, home security systems, and climate tech development. The project references academic research on bolometer manufacturing methods and the efficacy of leveraging colloidal quantum dots (QDs) for IR light sensing. Military contractors have also contributed to the research in the LWIR sensor and bolometer manufacturing spaces. For more information and to submit proposals, visit the DOD SBIR 24.4 Annual solicitation notice on grants.gov or the DOD SBIR/STTR Opportunities page. The open date for proposals is October 3, 2023, and the close date is March 31, 2025.

DOD SBIR 24.4 Annual - Forward Looking Infrared (FLIR) Dual Band Focal Plane Array in High Definition Format

Active

Department of Defense

The Department of Defense (DOD) is seeking proposals for the development of a small energy-efficient self-contained transceiver capable of wireless communication without using traditional radio frequency (RF) transport. The goal is to utilize a non-standard means of signal communication, such as magnetic, acoustic, or infrared, that is difficult to detect and report in covert activities. The transceiver should be highly resistant to interference, detection, and exploitation, and be self-contained, man-portable, easily concealable, and field programmable. The project duration is divided into two phases: Phase I involves creating a design and rationale supporting the solution, while Phase II focuses on developing and testing a prototype. The final product should be fully documented and include operating instructions, interface control documents, and programmability commands. The potential impacts of this technology include new mission deployment possibilities for remote sensor operation and control, as well as applications in areas such as home security, healthcare, additive manufacturing, and automotive safety. The deadline for proposal submission is March 31, 2025. For more information, visit the solicitation agency's website [here](https://www.defensesbirsttr.mil/SBIR-STTR/Opportunities/).

DOD SBIR 24.4 Annual - Low-cost Longwave Bolometer Camera Fabrication Techniques

Active

Department of Defense

The Department of Defense (DOD) is seeking proposals for the topic "Low-cost Longwave Bolometer Camera Fabrication Techniques" as part of their SBIR 24.4 Annual solicitation. The objective of this topic is to develop novel technologies and fabrication techniques to reduce the cost of sensor payloads based on resistive microbolometer technology. The focus is on reducing the unit cost of the focal plane array and supporting a low-cost sensor. The solutions should be ready to transition into a camera module development effort by the end of Phase II. The solicitation emphasizes the importance of thermal longwave infrared (LWIR) capabilities in various Army applications and the need for a thermal sensor payload with high-definition array and dramatically reduced unit price. The solutions can involve novel manufacturing techniques, new materials systems, innovative component or module designs, or other approaches. Direct to Phase II contracts will focus on demonstrating enabling developments, and Phase II sequential efforts will deliver a prototype payload meeting the specified requirements for evaluation by Army Unmanned Aircraft Systems (UAS) or other programs. Phase I of the solicitation is only accepting Direct to Phase II (DP2) proposals with a cost of up to $2,000,000 for an 18-month period of performance. DP2 proposals are highly encouraged if they meet the requirements. Proposals should demonstrate the estimated cost reduction compared to products made with current fabrication techniques and discuss the impact on size, weight, and power of a complete camera module. Initial ideas on potential paths for integration into a production camera module should also be discussed. Phase II involves designing and fabricating a prototype device that demonstrates the proposed solution to reduce thermal sensor payload unit cost. The impact of the solution on the unit price of a final sensor payload and its incorporation into such a payload should be discussed. Relevant interfaces should be defined and documented, and potential partnerships with integrators or other companies for follow-on efforts should be considered. In Phase III, the solicitation highlights the potential dual-use applications of leveraging bolometer manufacturing methods for low-cost long wave infrared (LWIR) sensors. These applications include smartphone camera augmentation, UAV camera augmentation (specifically via the Office of Naval Research), home security systems, and climate tech via quantum dot (QD) development. Overall, this solicitation seeks innovative solutions to reduce the cost of thermal sensor payloads based on resistive microbolometer technology, with potential applications in various military and commercial sectors.

DOD SBIR 24.4 Annual - Forward Looking Infrared (FLIR) Dual Band Focal Plane Array in High Definition Format

Active

Department of Defense

The Department of Defense (DOD) is seeking proposals for the development of a small energy-efficient self-contained transceiver capable of wireless communication without using traditional radio frequency (RF) transport. The goal is to utilize a non-standard means of signal communication, such as magnetic, acoustic, or infrared, that is difficult to detect and report in covert activities. The transceiver should be highly resistant to interference, detection, and exploitation, and be self-contained, man-portable, easily concealable, and field programmable. The project duration is divided into two phases: Phase I involves creating a plausible design and rationale supporting the solution, while Phase II focuses on developing and testing a prototype that demonstrates the desired capabilities. The project aligns with the Army's smart sensing initiatives and aims to provide an innovative alternate means of low probability of detection (LPD) and low probability of interception (LPI) communications. The solicitation is open until March 31, 2025. For more information, visit the [solicitation link](https://www.sbir.gov/node/2496863).

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