Device-Scale AFM-Thermoreflectance Hybrid Metrology
ID: 4Type: BOTH
Overview

Topic

Device-Scale AFM-Thermoreflectance Hybrid Metrology

Agency

Department of CommerceNational Institute of Standards and Technology

Program

Type: SBIRPhase: BOTHYear: 2024
Timeline
  1. 1
    Release Apr 16, 2024 12:00 AM
  2. 2
    Open Apr 16, 2024 12:00 AM
  3. 3
    Next Submission Due Jun 14, 2024 12:00 AM
  4. 4
    Close Jun 14, 2024 12:00 AM
Description

The Department of Commerce, specifically the National Institute of Standards and Technology, is seeking proposals for the FY2024 Small Business Innovation Research (SBIR) Program for CHIPS for America – CHIPS Metrology. The specific topic of the solicitation is "Device-Scale AFM-Thermoreflectance Hybrid Metrology".

This solicitation is focused on research and technology related to device-scale atomic force microscopy (AFM) and thermoreflectance hybrid metrology. The goal is to develop innovative solutions for measuring and characterizing the thermal properties of advanced electronic devices at the nanoscale level.

The potential impacts of this technology include improved understanding of heat transfer in electronic devices, leading to more efficient and reliable designs. This research can also contribute to the development of new materials and manufacturing processes for electronic devices.

The project duration for this solicitation is not specified, but the application due date is June 14, 2024. Funding specifics are not provided in the document.

For more information and to access the solicitation, visit the SBIR topic link: Device-Scale AFM-Thermoreflectance Hybrid Metrology. The full solicitation notice can be found on the grants.gov website: Solicitation Agency URL.

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