CHIPS Incentives Program – Commercial Fabrication Facilities
ID: 346349Type: Posted
Overview

Buyer

National Institute of Standards and Technology (DOC-NIST)

Eligible Applicants

Others

Funding Category

Science and Technology and other Research and Development

Funding Instrument

Other

Opportunity Category

Discretionary

Cost Sharing or Matching Requirement

Yes

Original Source

https://grants.gov/search-results-detail/346349

Additional Information

http://applications.chips.gov
Timeline
    Description

    The National Institute of Standards and Technology (NIST) is offering the CHIPS Incentives Program to support the construction, expansion, or modernization of commercial fabrication facilities in the U.S. semiconductor industry. This initiative aims to enhance economic and national security by fostering resilience in the semiconductor supply chain, with eligible projects requiring a minimum capital investment of $300 million and focusing on leading-edge and mature-node semiconductor production. The program allows for direct funding, loans, and loan guarantees, with a cumulative federal investment ceiling of $3 billion, and emphasizes workforce development, sustainability, and collaboration with educational institutions. Interested applicants must submit their proposals through the CHIPS Incentives Portal by June 18, 2024, and can reach out to Misty Roosa at apply@chips.gov for further inquiries.

    Point(s) of Contact
    apply@chips.gov
    Files
    Title
    Posted
    CHIPS-Commercial Fabrication Facilities NOFO Amendment 1.pdf
    CHIPS-Commercial.pdf
    The CHIPS Incentives Program, managed by the National Institute of Standards and Technology (NIST), seeks to bolster the U.S. semiconductor industry through financial support for the construction, expansion, or modernization of commercial fabrication facilities. The program is an effort to enhance economic and national security, with a particular focus on fostering resilience in the semiconductor supply chain. Eligible projects must involve capital investments of at least $300 million and include categories such as leading-edge and mature-node semiconductor production, wafer manufacturing, and semiconductor materials facilities. Applications can submit for direct funding, loans, and loan guarantees, with a cumulative Federal investment ceiling of $3 billion, contingent upon national security needs. The application process consists of several phases: a Statement of Interest, optional pre-application, full application, and due diligence, ensuring that projects align with program objectives and possess long-term commercial viability. Additionally, the program prioritizes workforce development, collaboration with educational institutions for training, and inclusion of disadvantaged individuals. The guidelines also emphasize sustainability, urging applicants to commit to ongoing investments in the U.S. semiconductor ecosystem. Overall, the CHIPS Incentives Program aims to reinforce the U.S.'s dominance in technology and manufacturing sectors essential for contemporary and future needs.
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