Sources Sought Notice for Test Vehicle to Study Reliability of Materials Used In Advanced Packaging of Semiconductor Chips
ID: NIST-SS25-CHIPS-0021Type: Sources Sought
Overview

Buyer

COMMERCE, DEPARTMENT OFNATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGYDEPT OF COMMERCE NISTGAITHERSBURG, MD, 20899, USA

NAICS

Analytical Laboratory Instrument Manufacturing (334516)

PSC

LABORATORY EQUIPMENT AND SUPPLIES (6640)

Original Source

https://sam.gov/opp/f418a64dc8414d2ba208039780b618bb/view
Timeline
    Description

    The National Institute of Standards and Technology (NIST) is seeking sources for a full turnkey test vehicle to study the reliability of materials used in the advanced packaging of semiconductor chips. The procurement aims to identify vendors capable of providing design and fabrication capabilities for logic and memory chips, silicon interposers, high-density organic substrates, and a complete assembly system, including functionality and long-term reliability testing. This initiative is crucial for enhancing the understanding of failure mechanisms in semiconductor packaging materials, which are vital for the performance and longevity of electronic devices. Interested parties should contact Nina Lin at nina.lin@nist.gov or Donald Collie at donald.collie@nist.gov for further details, noting that this is a Sources Sought Notice for market research purposes only and does not constitute a solicitation for contract award.

    Point(s) of Contact
    Nina Lin
    nina.lin@nist.gov
    Donald Collie
    donald.collie@nist.gov
    Files
    Title
    Posted
    Sources Sought Notice NIST-SS25-CHIPS-0021.docx
    The National Institute of Standards and Technology (NIST) has issued a Sources Sought Notice (NIST-SS25-CHIPS-0021) seeking market research to identify sources capable of providing a full turnkey test vehicle. This vehicle is essential for studying the reliability of materials used in the advanced packaging of semiconductor chips. Requirements include the design and fabrication capabilities for logic and memory chips, silicon interposers, high-density organic substrates, and a complete assembly system, including testing for functionality and long-term reliability. The notice outlines necessary capabilities such as schematic and layout design, fabrication processes, and testing methodologies to assess failure mechanisms in packaging materials. Respondents are asked to provide detailed information about their products, services, and customization options, along with their business status and past customer information. This notice emphasizes that it is for market research purposes only, not a solicitation, and does not obligate the government to award a contract. It serves to gather suitable vendors for potential future solicitations, aiming to enhance the understanding of market capabilities in semiconductor packaging reliability research.
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