The Defense Microelectronics Activity (DMEA) is seeking qualified commercial entities to establish partnerships for the collaborative manufacturing of thick Silicon Carbide (SiC) epitaxial layers, which are crucial for high-voltage Department of Defense (DoD) applications. The primary objective is to secure a reliable supply of high-quality, thick epitaxial SiC on 150- or 200mm wafers, addressing current challenges in commercial SiC manufacturing, such as high costs and limited availability. This initiative not only aims to meet DoD requirements but also allows for potential surplus production to be sold commercially, enhancing the overall market for SiC materials. Interested firms are encouraged to submit a white paper detailing their qualifications and proposed partnership models by the extended deadline, with inquiries directed to Robert Crandell at robert.d.crandell.civ@mail.mil.