HPCMP Technical Insertion BOA On Ramp Opportunity
ID: PANERD-24-P0000_001928Type: Combined Synopsis/Solicitation
Overview

Buyer

DEPT OF DEFENSEDEPT OF THE ARMYW2R2 USA ENGR R AND D CTRVICKSBURG, MS, 39180-6199, USA

NAICS

Computer and Peripheral Equipment ManufacturingT (33411)

PSC

IT AND TELECOM - HIGH PERFORMANCE COMPUTE (HARDWARE AND PERPETUAL LICENSE SOFTWARE) (7B20)

Original Source

https://sam.gov/opp/4480e2f6a1e740658ca0a9efdb803221/view
Timeline
    Description

    The Department of Defense, through the U.S. Army Engineering Research and Development Center (ERDC), is seeking proposals for the HPCMP Technical Insertion Basic Ordering Agreement (BOA) On Ramp Opportunity, aimed at enhancing high-performance computing capabilities. This procurement invites firms of any size to demonstrate their ability to deliver advanced, production-grade high-performance computing systems, with an estimated total remaining capacity of $169 million available for the ordering period. The initiative is critical for supporting the Department of Defense's research, development, test, and evaluation community, emphasizing the importance of state-of-the-art computational technologies in advancing military capabilities. Proposals must be submitted by October 17, 2024, and interested parties can contact Melissa Lynn at melissa.k.lynn@usace.army.mil or Kevin Culley at kevin.j.culley@usace.army.mil for further information.

    Files
    Title
    Posted
    B01.01 Combined Synopsis_Solicitation-FY25-BOA-On-Ramping-2024.09.13.pdf
    The U.S. Army Engineering Research and Development Center (ERDC) is soliciting proposals under the combined synopsis/solicitation for the Technology Insertion (TI) Basic Ordering Agreement (BOA) FY25 On-Ramping. This procurement aims to identify capable firms to enhance the High Performance Computing Modernization Program (HPCMP) by providing advanced, production-grade High Performance Computing (HPC) systems. The initiative, with an estimated remaining capacity of $169 million, seeks proposals from businesses of any size to support the Department of Defense’s research community by integrating state-of-the-art computational technologies. Proposals must demonstrate the ability to deliver systems with specified computational capabilities, including a high memory bandwidth, multiple petabyte storage, and adherence to security protocols. The BOA will not guarantee orders and allows for industry competition while adhering to federal regulations. Submissions should be sent by October 17, 2024, and the resulting agreements will enable firms to compete for subsequent HPCMP orders through the established BOA framework, which was initiated in October 2021 and extends until October 2026. This program emphasizes the critical role of high-performance computing in advancing U.S. military technology and capabilities.
    B01.01 Combined Synopsis_Solicitation-FY25-BOA-On-Ramping-AM0001 2024.09.17.pdf
    The combined synopsis/solicitation PANERD-24-P-0000-001928 seeks proposals for the Technology Insertion Basic Ordering Agreement (BOA) for the U.S. Army Engineering Research and Development Center (ERDC) concerning supercomputing capabilities under the High Performance Computing Modernization Program (HPCMP). The solicitation invites firms to demonstrate their ability to provide commercial-grade high performance computing systems valued at approximately $169 million, with an emphasis on advanced computational architectures and operational capabilities tailored for Department of Defense use. Proposals must be submitted by October 17, 2024, with evaluations based on technical merit, past performance, and small business participation. BOAs, serving as framework agreements rather than contracts, will be open to all qualifying firms and will allow for future orders to enhance research and testing operations across four designated DoD Supercomputing Resource Centers. The document outlines specific technical requirements, administrative expectations, security protocols, and the process for on-ramping new contractors within the existing agreement, ensuring alignment with the government’s strategic objectives.
    Lifecycle
    Title
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    HPCMP Technical Insertion BOA On Ramp Opportunity
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    Combined Synopsis/Solicitation
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