Cryogenic Microsystems Thermal Packaging RFI + Workshop Special Notice
ID: DARPA-SN-24-106Type: Special Notice
Overview

Buyer

DEPT OF DEFENSEDEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA)DEF ADVANCED RESEARCH PROJECTS AGCYARLINGTON, VA, 222032114, USA

NAICS

Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) (541715)

PSC

NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; EXPERIMENTAL DEVELOPMENT (AC13)

Original Source

https://sam.gov/opp/ee9f0886705d44d48224f649029a0afa/view
Timeline
    Description

    The Defense Advanced Research Projects Agency (DARPA) is seeking information on innovative approaches and technologies for the thermal packaging of cryogenic microsystems, specifically within the temperature range of 10 mK to 77 K. The objective is to identify advanced materials and strategies that can enhance the performance and energy efficiency of computing systems in cryogenic environments, addressing challenges related to thermal insulation, heat transmission, and interconnects. This initiative is crucial for advancing high-performance computing capabilities, and DARPA will host an in-person workshop on December 2, 2024, at Booz Allen Hamilton in McLean, VA, to discuss the state-of-the-art in this field. Interested parties must register for the workshop by November 18, 2024, and can direct inquiries to the BAA Coordinator at DARPA-SN-24-106@darpa.mil.

    Point(s) of Contact
    BAA Coordinator
    DARPA-SN-24-106@darpa.mil
    Files
    Title
    Posted
    DARPA-SN-24-106.pdf
    The Defense Advanced Research Projects Agency (DARPA) has issued a Request for Information (RFI) regarding cryogenic microsystems thermal packaging, with a focus on technologies functioning between 10 mK and 77 K. The RFI aims to identify advanced materials and strategies for thermal packaging that can enhance the performance and energy efficiency of computing systems compared to current market standards. Responses are encouraged from a wide array of stakeholders, including private companies, universities, and research institutions, highlighting recent innovations in thermal insulation, heat transmission, and interconnects suitable for cryogenic environments. The responses to the RFI will inform a workshop scheduled for December 2, 2024, where participants will discuss the state-of-the-art in cryogenic thermal packaging, address challenges, and promote collaboration between various fields. The workshop seeks to foster an understanding of the complexities involved in developing scalable cryogenic systems. Prospective attendees must register by November 18, 2024. This initiative represents DARPA’s commitment to advancing technology essential for high-performance computing in cryogenic conditions, thereby enhancing the capabilities and efficiency of future systems.
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    Cryogenic Microsystems Thermal Packaging RFI + Workshop Special Notice
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