Circuit Card Assembly
ID: SPRDL1-25-R-0076Type: Sources Sought
Overview

Buyer

DEPT OF DEFENSEDEFENSE LOGISTICS AGENCYDLA LAND WARRENWARREN, MI, 48397, USA

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

PSC

ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE (5998)

Set Aside

Total Small Business Set-Aside (FAR 19.5) (SBA)

Original Source

https://sam.gov/opp/1b92a0dfcae54347b849dcc4f9a2e8c6/view
Timeline
    Description

    The Department of Defense, through the Defense Logistics Agency (DLA) Land Warren, is seeking sources for the procurement of Circuit Card Assembly, specifically for the FS3 Logic Control identified by part number 13023194. This opportunity is set aside for total small businesses and requires adherence to specific Federal Acquisition Regulation (FAR) guidelines, including military-level packaging and preservation standards as outlined in the associated Special Packaging Instructions. The Circuit Card Assembly is critical for various defense applications, necessitating strict compliance with quality assurance measures, including a first article test report and comprehensive documentation for traceability. Interested parties must submit their bids by April 1, 2025, at 2:00 PM local time, and can reach out to Kimberly Houghton at kimberly.houghton@dla.mil or Sabrina Krafft at sabrina.krafft@dla.mil for further inquiries.

    Point(s) of Contact
    Kimberly Houghton
    (586) 467-1228
    kimberly.houghton@dla.mil
    Sabrina Krafft
    (586) 467-1177
    sabrina.krafft@dla.mil
    Files
    Title
    Posted
    Special Packaging Instructions (SPI) AM13023194.PDF
    The document outlines the special packaging instructions for a Circuit Card Assembly, FS3 Logic Control, identified by part number 13023194 and national stock number 5998-01-671-8483. It specifies military preservation requirements according to MIL-STD-2073-1, detailing cleaning, drying, packing, and marking procedures necessary for the item's protection during transport. The document emphasizes the need for appropriate cushioning materials, such as crumpled kraft paper or plastic cushioning, to prevent shifting in transit. Additionally, it instructs on the use of specific containers based on ASTM standards, ensuring each unit is securely packed. The document also notes that various specifications, standards, and drawings form part of these instructions, which must be followed to guarantee compliance with quality and testing requirements. Overall, these packaging guidelines are essential for maintaining the safety and integrity of the circuit card assembly during shipping and handling.
    SPRDL125R0076.pdf
    The document is a solicitation for a government contract concerning a total small business set-aside for the supply of the Circuit Card Assembly, with specific Federal Acquisition Regulation (FAR) guidelines. It outlines the instructions for submission, including deadlines, technical requirements, and proposal preparation. Key details include that bids must be received by April 1, 2025, at 2:00 PM local time, and that late submissions will not be considered. The contract specifies that a first article test report is required, indicating the need for quality assurance before production. The contractor is responsible for maintaining comprehensive documentation for traceability of all supplies provided. It also mandates military-level packaging, preservation, and specific inspection requirements at the origin. Notably, there are provisions related to the use of ozone-depleting substances, qualifications for the suppliers, and a clear outline of inspection protocols. This solicitation reflects the government's commitment to transparency and quality assurance in procurement while adhering to environmental standards and supporting small businesses.
    Lifecycle
    Title
    Type
    Circuit Card Assembly
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