The Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program, managed by Dr. Anna Tauke-Pedretti at DARPA, seeks to advance technologies for creating high-density photonic systems integrated with microelectronics. The program aims to develop scalable 3D optical routing solutions through two phases over 36 months, with an estimated funding of $30 million. In Phase 1, the focus is on demonstrating the feasibility of 3D routing and assessing the link's performance across defined metrics, including optical loss and scalability. Phase 2 will enhance array density and size scaling while proving the manufacturability of the developed solutions. Proposers are required to submit a structured abstract by October 1, 2024, followed by full proposals due by October 29, 2024. The evaluation criteria include scientific merit, relevance to the DARPA mission, and cost realism. The program emphasizes the importance of adhering to guidelines and submission protocols to avoid disqualification, while also encouraging innovation in addressing government and defense needs. The overarching goal of the HAPPI initiative is to facilitate breakthroughs in optical connectivity for national security applications.

The Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program, led by Dr. Anna Tauke-Pedretti at DARPA, is aimed at revolutionizing photonic technology for national security applications. The program intends to demonstrate advanced 3D adaptive optical links that facilitate higher density and efficiency in microsystem interconnections. The initiative comprises two phases over three years, with an anticipated budget of $30 million. Phase 1 focuses on proving the feasibility of 3D routing between photonic integrated circuits and ensuring mechanical and thermal robustness. Key deliverables include demonstrating scalable optical connections with minimal loss. Phase 2 will emphasize scaling array density and manufacturability of the routing platform. Proposals must be unclassified and follow stringent guidelines detailed in the BAA (Broad Agency Announcement). Interested parties must submit abstracts by October 1, 2024, with official proposals due by October 29, 2024. Data rights specifications and compliance with the DARPA mission will guide the evaluation process. The program’s ultimate goal is to foster innovation in optical technology while enhancing defense capabilities through advanced materials and systems integration.

The Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) initiative focuses on advancing the development of photonic interfaces that are adaptable and heterogeneously produced. The Proposer's Day recording outlines the goals of the project, which include fostering innovation in photonic technology to enhance communication, sensing, and imaging capabilities. Key discussions revolve around potential applications, the importance of collaboration among various stakeholders, and the types of proposals that would align with the project's objectives. Participants are encouraged to explore creative solutions and technologies that integrate different materials and production methods to achieve dynamic functionality in photonic systems. The initiative highlights the federal government's commitment to funding research and development in high-tech fields, aiming to catalyze advancements that will have broad implications across multiple sectors. This document calls for engagement from researchers and organizations that can contribute novel ideas and practices to the rapidly evolving field of photonics, ensuring alignment with the government's strategic interests in technological innovation and competitive advantage.

The Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program, managed by DARPA, aims to develop advanced photonic interfaces to enhance optical connections in dense photonic circuits with minimal loss. This initiative focuses on innovations in vertical waveguiding, material transitions, and optical mode adaptation, all of which are deemed critical for Department of Defense applications. The document serves as a guide for handling Controlled Unclassified Information (CUI), explaining protections and safeguarding measures mandated by federal regulations. It delineates the roles of authorized personnel, defines categories of CUI relevant to HAPPI—such as Controlled Technical Information, Proprietary Business Information, and Export Controlled information—and specifies obligations under the Freedom of Information Act (FOIA). The guide also outlines processes for public disclosure requests, reporting unauthorized disclosures, and establishing coordination for foreign disclosures. The HAPPI program reflects the government's emphasis on safeguarding sensitive technological advances while ensuring appropriate dissemination of information consistent with national security interests.

The document outlines a proposal titled HR001124S0038, centered on an initiative by HAPPI. It emphasizes the need for a comprehensive graphical representation of the proposed solution, focusing on innovative aspects and how the proposing team intends to meet program metrics. Additionally, it addresses the primary technical challenges that may impede success and identifies existing results that serve as a foundation for development. The document also calls for a description of the team's collaboration and expertise in tackling the initiative. Overall, the aim is to ensure a well-structured approach to address the project's objectives, showcasing innovation and technical capability within the context of government RFPs, federal grants, and state/local proposals.

The Broad Agency Announcement HR001124S0038 details the process for submitting abstracts related to a research proposal solicitation by DARPA. All submissions must adhere to specific formatting guidelines, limiting abstracts to a maximum of six pages while excluding certain components like the cover letter and bibliography. Proposers are required to provide an abstract prior to submitting a full proposal, with DARPA offering feedback on whether to proceed, although this feedback does not guarantee funding. Key sections of the abstract must include innovative claims, a detailed technical approach addressing program goals and capabilities, management plan emphasizing team expertise, and an outline of estimated costs and project timelines. A summary slide is also required. Compliance with these submission instructions is critical, as abstracts received after the deadline will not be reviewed. This solicitation emphasizes a structured, transparent approach to research proposal development, ensuring that all submissions align with DARPA's evaluation criteria.

The document outlines the proposal instructions for the Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program under DARPA's Broad Agency Announcement (BAA) HR001124S0038. It mandates that all proposals include both written content and oral presentation slides, which must comprehensively detail the proposed technical approach, metrics, and risk mitigation strategies. Proposals must adhere strictly to format guidelines, with Volume 1 limited to 10 pages and oral presentations capped at 20 slides. Key sections of Volume 1 include the Executive Summary, Goals and Impact, Technical Approach, Management Plan, Schedule and Milestones, and Intellectual Property considerations. The oral presentations, scheduled from November 18 to November 22, 2024, will allow 40 minutes for each proposal, followed by a Q&A session with an evaluation panel. Proposals must demonstrate innovation in addressing technical challenges in photonic technologies and outline a commercialization strategy. The document stresses compliance with specific guidelines concerning organizational conflicts of interest and intellectual property rights. Overall, the HAPPI proposal aims to encourage innovative research in photonic integrated circuits, emphasizing technical depth, management structure, and strategic planning to advance U.S. capabilities in this field.

The document outlines the cost proposal instructions for the federal project HR001124S0038, focused on developing Heterogenous Adaptively Produced Photonic Interfaces (HAPPI). It specifies that the Cost Volume must encompass the complete program, including both base and optional elements, and must be formatted accordingly. Proposals should utilize the DARPA Standard Cost Proposal Spreadsheet for detailed cost submissions, ensuring traceability across different documents and organization levels. The cost proposal must include comprehensive details, covering direct labor, indirect costs, materials, equipment purchases, travel, consultant costs, and any proposed sub-awardee costs. It mandates transparency and clarity in cost breakdowns, assigning a clear link between tasks and their respective costs in the Statement of Work (SOW). Fulfilling the proposal requirements requires adherence to specific regulations, including those related to cost accounting systems and small business subcontracting plans if applicable. The document sets rigorous standards for potential contractors and emphasizes timely submission alongside proprietary sub-awardee proposals. Overall, this solicitation aims to streamline the government's contract evaluation process by ensuring organized and compliant cost submissions while requiring detailed justifications of proposed expenses.

The DARPA Standard Cost Proposal Spreadsheet, dated November 2021, is designed to facilitate the submission and evaluation of cost proposals for federal contracts, grants, and other financial agreements. Proposers must adhere to strict guidelines regarding the inclusion of detailed cost data across various categories, including direct labor, subcontracting, and overhead expenses. The spreadsheet consists of multiple tabs for project-specific cost calculations, emphasizing the importance of providing comprehensive and justified cost data to support proposed expenses. Options not fully priced are excluded from the award process, reinforcing the need for thoroughness in proposals. Each proposer must ensure consistency across all tabs, use specified color-coded areas for data entry, and maintain accuracy in their labor rates and indirect costs. The document also stresses the proposer’s responsibility for the veracity and completeness of submitted data and provides avenues for feedback on the spreadsheet format. Ultimately, the spreadsheet is crucial for enabling efficient analysis and negotiation of costs for federal projects, reflecting the government’s structured approach to budgeting and procurement.

The document outlines certifications required for federal contract solicitations, specifically focusing on compliance with various laws and regulations. It includes affirmations that the offeror is not debarred or suspended from transactions, will maintain a drug-free workplace, and complies with nondiscrimination laws. Additional requirements apply for contracts exceeding $100,000, addressing the prohibition of using federal funds for lobbying activities and reflecting on the corporation's tax liabilities and felony convictions within the prior two years. There is also a prohibition on contracting with entities that impose confidentiality agreements that restrict reporting of fraud or abuse. Furthermore, it discusses restrictions related to telecommunications equipment and services, emphasizing compliance with existing laws concerning the use of potentially harmful technologies. Lastly, the document seeks information on team composition, specifically regarding the participation of nontraditional defense contractors and cost-sharing commitments. This framework serves to ensure ethical practices and compliance in federal contracting processes.

The file HR001124S0038 outlines the Heterogeneous Adaptively Produced Photonic Interfaces (HAPPI) project, which aims to advance photonic interface technologies through innovative research. The document provides a project overview detailing its significance, including objectives and metrics defined by both the government and the performer. It describes specific technical tasks and deliverables structured in phases, emphasizing clarity and thoroughness without the inclusion of images or charts. Additionally, it highlights program management responsibilities, including subcontractor oversight and reporting requirements. Meeting and travel obligations are specified to ensure compliance with program solicitations, while considerations for government-furnished information and property are noted, necessitating formal reconciliation in final agreements. This document serves as a foundational guide for the successful execution of the HAPPI project within the context of federal RFPs, delineating essential tasks and expectations for the performer.

The document outlines a SCHEDULE OF MILESTONES AND PAYMENTS pertinent to a federal government agreement, specifically detailing the process for milestone completion and associated payments. The purpose is to establish a comprehensive framework for measuring project progress through specific, measurable events, such as completing a baseline execution plan or final report. The Agreement specifies a term that starts from the effective date, detailing that payments correspond to actual costs incurred upon the completion of milestones. Each milestone is categorized with defined tasks, due dates, exit criteria, and deliverables, along with DARPA payment amounts and relevant funding lines. This structured approach ensures clarity in expectations and accountability for funding disbursements, facilitating effective project management within government contracts. Overall, the document emphasizes the importance of measurable outcomes in federally funded projects and sets a clear roadmap for achieving the agreed-upon objectives.

The document serves as a checklist for proposers creating a cost volume for a government proposal, specifically related to federal grant requests. It outlines essential components to include in the Cost Proposal cover sheet, emphasizing completeness and clarity. Key requirements involve providing detailed summaries of costs by phase and year, breakdowns of major cost items such as direct labor, indirect costs, and materials, as well as documentation for travel expenses and subcontractor agreements. Proposers must include justifications for labor costs and comprehensive documentation for any subcontractors or consultants involved. Additional stipulations address the necessity of demonstrating compliance with Federal contracting requirements and potential conflicts of interest. The checklist also inquires about the existence of a DCAA-approved cost accounting system, indicating the importance of adherence to regulatory standards in government contracting. This document is critical for ensuring that proposals meet the thorough specifications required by government entities, thereby facilitating the review process and compliance with financial regulations.

The document outlines the Controlled Unclassified Information (CUI) Guide for the Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program, managed by DARPA. It aims to develop adaptive photonic interfaces that improve optical connectivity among photonic integrated circuits (PICs) with low loss, advancing technologies critical to the Department of Defense (DoD). The guide emphasizes the protection of sensitive yet unclassified information, detailing the identification and management of CUI according to DoDI 5200.48 standards. It specifies the types of CUI involved in HAPPI, including Controlled Technical Information (CTI), Proprietary Business Information, and Export Controlled information, while addressing the complexities of handling such information under the Freedom of Information Act (FOIA). The guide also includes procedures for unauthorized disclosures, the responsibilities of personnel in protecting CUI, and the need for compliance with federal security regulations. The overall objective is to ensure the confidentiality and security of sensitive information critical to national security while enabling the effective execution of the HAPPI program. This document serves as a comprehensive framework for those involved in the project to manage and protect information appropriately.

The Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program, funded by DARPA with a budget of $30 million over 36 months, seeks to advance photonic technologies through multiple awards. The program prioritizes the development of optoelectronic interfaces that function across a 400-1800 nm wavelength range without strict material constraints, promoting both semiconductor and non-semiconductor substrates, including glass. Proposals can feature various alignment techniques and address optical routing without requiring specific architectures or latency metrics. Key elements outlined in the FAQs include the allowance of multiple abstracts per organization, and that reconfirmability and tunability are not essential requirements. Testing and evaluation will be conducted by performers, not the government. The program supports collaborations and encourages integration of photonic and electronic connections. Importantly, proposals must demonstrate paths to manufacturability and meet metrics for link sizes and efficiencies, with emphasis on both point-to-point and chip-to-chip connectivity. Overall, the HAPPI program aims to foster innovative approaches to optical interconnects, facilitating advanced communication technologies in defense applications while ensuring responsive design adaptability to diverse materials and architectures.

The Heterogeneous Adaptively Produced Photonic Interfaces (HAPPI) program, funded by DARPA with a total budget of $30 million for 36 months, aims to advance the development of optical interfaces that facilitate integration across various materials. The document outlines key technical requirements and guidelines for proposals, specifying the need for constant interconnect pitch and spectral bandwidth while allowing flexibility in material choices. Proposers are encouraged to submit multiple abstracts but limited to one proposal per organization. Features such as alignment, layer integration, and electrical compatibility are addressed, with an emphasis on presenting solutions that support automation and chip-scale manufacturing. The document clarifies that free-space optics are not permissible, and while reconfugurability is not required, proposals should demonstrate adaptability for optical alignment. Testing metrics and specifications for phase demonstrations are articulated, emphasizing uniform performance sampling and the potential for vertical stacking beyond two chips. The program encourages innovative approaches while maintaining a foundation for future DoD application transitions. This FAQ document serves as a critical resource for prospective applicants navigating the intricacies of the program’s expectations and requirements.

The Heterogeneous Adaptively Produced Photonic Interfaces (HAPPI) program, with a total funding of $30 million for a duration of 36 months, aims to develop advanced photonic interface technologies through multiple awards. Key aspects include the requirement for a constant interconnect pitch and spectral bandwidth across a specified wavelength range, as well as acceptance of various substrate types, including non-semiconductors like glass. Proposals are encouraged to address scalability, alignment compatibility, and integration of photonic components, although alignment and specific bitrate or latency targets are not mandated. Participants can submit multiple abstracts but are limited to one proposal per organization. Collaboration with international entities is permissible, and diverse technological approaches are welcomed to meet program metrics. The program emphasizes the need for robust integration strategies while permitting variations in routing architectures. There are no stringent requirements for polarization maintenance or power consumption, and the program is not limited to two-chip stacks. Overall, the HAPPI program seeks innovative solutions for integrated photonic technologies, promoting a variety of methodologies to enhance optoelectronic performance and integration.

The Heterogeneous Adaptively Produced Photonic Interfaces (HAPPI) Program, with a budget of $30 million for 36 months, seeks multiple awards for innovative photonic interface solutions within the 400-1800 nm wavelength range. Key program requirements include maintaining a constant interconnect pitch of 3 µm x 3 µm and a spectral bandwidth of 100 nm. The use of both semiconductor and non-semiconductor materials is encouraged, as well as the potential for integration with existing foundry processes. Proposals must demonstrate capabilities concerning alignment, single or multiple proposal submissions, and describe the fabrication approach without mandating alignment or specific bitrates. Notably, free-space optics are excluded, while ideas for scaling and adaptability of solutions are welcomed. The program also emphasizes the importance of demonstrating viable link arrays, which should consist of at least four layers. Lastly, the inclusion of active material platforms in functional links is necessary for phases one and two. The overall intent of the HAPPI program is to develop foundational technology for further Defense Department applications while making the proposal process accessible to both domestic and international entities.

The Heterogeneous Adaptively Produced Photonic Interfaces (HAPPI) program, managed by DARPA, is offering a total funding of $30 million over 36 months, aiming for multiple awards. The program focuses on the development of optical interfaces utilizing various materials, including non-semiconductors, and encourages innovative approaches in optical routing and alignment. Although there are no strict requirements for alignment, reconfugurability, or specific architectures, proposals must demonstrate compatibility with active optoelectronic components. Key considerations include the maximum number of layers, power consumption, international collaboration, and the ability to accommodate diverse chip configurations. The program is open to both U.S. and international entities. Proposers will need to address scalability, demonstrate ideas through analyses, and ensure manufacturability. The program promotes foundational technology that could lead to specific DoD applications while emphasizing thorough documentation and feedback processes. Overall, HAPPI aims at advancing photonic technologies through innovative research and development outreach, fostering creative solutions in the optical interconnect space.

The Defense Advanced Research Projects Agency (DARPA) is issuing a Broad Agency Announcement (BAA) for innovative proposals under the H APPI program, aimed at developing Heterogeneous Adaptively Produced Photonic Interfaces. This program seeks advanced concepts for high-density, three-dimensional optical routing within integrated photonic microsystems, promising a 1000-fold increase in information transmission density. Key objectives include enhancing link efficiency while expanding photonic link density, fostering scalable manufacturing processes, and enabling novel microsystem applications like digital compute and remote sensing. The program comprises two phases over 36 months, with Phase 1 focusing on feasibility demonstration of low-loss optical routing and Phase 2 on scaling and manufacturability verification. Applicants must submit abstracts by October 1, 2024, followed by full proposals due by October 29, 2024, with an estimated $30 million in funding for multiple awards. Evaluation will consider scientific merit, relevance to national security, and cost realism. The program encourages participation from U.S. and non-U.S. entities, with an emphasis on fostering a domestic photonic manufacturing ecosystem that aligns with DARPA's mission of preventing technological surprise and enhancing U.S. defense capabilities.

The Defense Advanced Research Projects Agency (DARPA) has issued a Broad Agency Announcement (BAA) for the Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program, aiming to significantly enhance optical routing in integrated photonic microsystems. This amended announcement extends the proposal date and corrects prior metrics. DARPA seeks innovative proposals for high-density 3D chip-to-chip and intra-chip optical routing to push the limits of current photonic technology, aiming for a 1000x increase in information transmission density. The program consists of two phases over 36 months, emphasizing the feasibility and scalability of 3D optical routing while overcoming current limitations in out-of-plane routing and efficiency. The anticipated $30 million in funding will support multiple awards, with proposals evaluated based on scientific merit, relevance to DARPA's mission, and cost realism. Key deliverables include demonstrating low-loss optical links and performance assessments at different stages. Proposers are encouraged to collaborate and submit plans that will contribute to a new domestic photonic manufacturing capability that benefits both commercial and defense applications. Compliance with intellectual property regulations and adherence to stringent testing and evaluation guidelines are also highlighted within the announcement.

The Defense Advanced Research Projects Agency (DARPA) is issuing a Broad Agency Announcement (BAA) for the Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program, aimed at significantly enhancing optical routing in integrated photonic microsystems. The program seeks innovative proposals for creating high-density, three-dimensional optical links within and between chips to improve information transmission density by 1000 times. Key metrics include minimizing optical loss, maintaining link efficiency, and achieving robust designs resilient to fabrication misalignment. The initiative is structured over 36 months, divided into two phases—Phase 1 focuses on demonstrating feasibility through a 10x10 array of optical links, while Phase 2 aims to scale this to a 1000x1000 array. Funding of $30 million is available with multiple awards anticipated. Evaluation criteria for proposals prioritize scientific merit, contribution to national security, and cost realism. Interested parties must submit abstracts and proposals by specified deadlines, with provisions for government collaboration throughout the project. This program is part of DARPA’s strategy to advance domestic photonic manufacturing capabilities, enhancing both commercial and defense applications.

The Defense Advanced Research Projects Agency (DARPA) is launching a Broad Agency Announcement (BAA) under the funding opportunity titled "Heterogenous Adaptively Produced Photonic Interfaces" (HAPPI). This initiative seeks innovative proposals focused on advanced techniques for high-density 3D optical routing in integrated photonics. The HAPPI program aims to enhance information transmission density within microsystems by creating efficient, high-density photonic links capable of supporting diverse signal types and high data rates, thus overcoming current technological limitations. Funding of $30 million is available, with proposals due by October 29, 2024, after a series of preliminary submission dates. The program consists of two 18-month phases, with the first focused on demonstrating the feasibility of 3D routing techniques and the second on scaling the technology for manufacturability. Evaluation of proposals will emphasize scientific merit, alignment with DARPA's mission, and cost realism. The program promotes collaboration among various research organizations, aiming to establish a domestic ecosystem supporting advanced photonic manufacturing. Proposals are encouraged from both U.S. and international sources, with a special emphasis on participation from Historically Black Colleges and Universities and small business entities.