Open Topic for Radiation Hardened Microelectronics
ID: MDA23-P001Type: Phase I
Overview

Topic

Open Topic for Radiation Hardened Microelectronics

Agency

Department of DefenseN/A

Program

Type: STTRPhase: Phase IYear: 2023

Topic Link

https://www.sbir.gov/node/2448123

Additional Information

https://www.defensesbirsttr.mil/
Timeline
  1. 1
    Release Aug 23, 2023 12:00 AM
  2. 2
    Open Sep 20, 2023 12:00 AM
  3. 3
    Next Submission Due Oct 18, 2023 12:00 AM
  4. 4
    Close Oct 18, 2023 12:00 AM
Description

The Department of Defense (DoD) is seeking proposals for an open topic on Radiation Hardened Microelectronics (RadHard ME) for missile defense applications. The objective of this solicitation is to solicit potentially valuable small business innovations in RadHard ME and expand the relevance of the Small Business Technology Transfer (STTR) programs. The government is particularly interested in proposals that address radiation effects on electronic devices, new single event effects (SEE) test methodologies, modeling and simulation methodologies for evaluating radiation damage and survivability, system component health monitoring during radiation events, automated test software using Artificial Intelligence/Machine Learning (AI/ML), RF communications in a radiation environment, and RadHard ME optimized for size, weight, and power (SWaP). The project will be conducted in three phases: Phase I involves a feasibility study, Phase II requires the completion of a prototype, and Phase III focuses on engineering and manufacturing development, test, and evaluation. The project is restricted under the International Traffic in Arms Regulation (ITAR) and the Export Administration Regulation (EAR). The solicitation is closed, and the application due date was October 18, 2023. For more information, visit the DoD STTR 23.C BAA solicitation on grants.gov.

Files
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