Robotic Electronic Component Replacement and Soldering in a Digital Depot Environment
ID: AF241-D011Type: BOTH
Overview

Topic

Robotic Electronic Component Replacement and Soldering in a Digital Depot Environment

Agency

Department of DefenseN/A

Program

Type: SBIRPhase: BOTHYear: 2024

Topic Link

https://www.sbir.gov/node/2479913

Additional Information

https://www.defensesbirsttr.mil/SBIR-STTR/Opportunities/
Timeline
  1. 1
    Release Nov 29, 2023 12:00 AM
  2. 2
    Open Jan 3, 2024 12:00 AM
  3. 3
    Next Submission Due Feb 21, 2024 12:00 AM
  4. 4
    Close Feb 21, 2024 12:00 AM
Description

The Department of Defense (DOD) is seeking proposals for the topic of "Robotic Electronic Component Replacement and Soldering in a Digital Depot Environment" under the SBIR 24.1 BAA. The objective is to research, evaluate, and develop a robotic system that can automate the removal and replacement of through-hole and surface mount electronic components during the repair of printed circuit board assemblies (PCBAs) in low-volume, high-mix environments. The current manual process for PCBAs rework in USAF depots can be improved in terms of safety, quality, agility, and throughput metrics through the use of automated systems. The proposed robotic system should be able to handle the flexibility required in manually operated PCBAs and comply with industry standards. The project will progress through Phase II, where a working prototype of the robotic system and associated software will be developed. The ultimate goal is to achieve a production-ready state for marketing to the Air Force, other federal agencies, and private industry. Relevant keywords include robotic soldering, robotic desoldering, printed circuit card, and electronics rework.

Files
No associated files provided.
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