DOD SBIR 24.4 Annual

Active
Yes
Status
Open
Release Date
October 3rd, 2023
Open Date
October 3rd, 2023
Due Date(s)
March 31st, 2025
Close Date
March 31st, 2025
Topic No.
A244-030

Topic

Miniaturization of Hyperspectral Sensors for UAS Applications

Agency

Department of DefenseN/A

Program

Type: SBIRPhase: BOTHYear: 2024

Summary

The Department of Defense (DOD) is seeking proposals for the topic "Miniaturization of Hyperspectral Sensors for UAS Applications" as part of their SBIR 24.4 Annual solicitation. The objective of this topic is to develop a compact, passive, day/night capable hyperspectral sensor that meets Size, Weight, and Power (SWaP) requirements for integration into ongoing modernization programs. The sensor should result in cost savings and reductions in weight, power, and volume without sacrificing capability. The sensor payload will be developed for use on smaller Unmanned Aerial Systems (UASs). Historically, airborne hyperspectral imaging (HSI) systems have been limited to larger aircraft due to heavy and complex optical components, high power consumption, and large ancillary hardware. This limits accessibility and availability. The solicitation is accepting Direct to Phase II (DP2) proposals with a cost of up to $2,000,000 for a 24-month period of performance. Proposers interested in submitting a DP2 proposal must provide documentation to substantiate the scientific and technical merit and feasibility equivalent to a Phase I project. During Phase II, firms should complete the sensor design, fabricate and test the component, integrate it into a gimbal for final integration onto a Class II or smaller UAS platform, refine the design as necessary, and validate sensor payload performance in a government-run laboratory. They should also define relevant interfaces for integration and lay out a high-level plan for how the component could be integrated into a UAS platform. In Phase III, the sensor/gimbal payload should be integrated into a prototype system for field collection. The sensor should be deployed on at least one test event to observe performance and generate quantitative/qualitative sensor performance data. The topic references relevant research papers on hyperspectral imaging systems. The keywords for this topic are Hyperspectral, VNIR, SWIR, and LWIR. For more information and to submit proposals, visit the DOD SBIR 24.4 Annual solicitation page on grants.gov: link.

Description

OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Integrated Sensing and Cyber; Microelectronics

 

OBJECTIVE: Further develop existing sensor or prototype to meet the necessary Size, Weight and Power (SWaP) requirements for integration into various ongoing modernization programs. This topic seeks to develop a direct-to-phase-two, internally calibrated, compact, passive, day/night capable hyperspectral (hundreds of channels) sensor that will result in up to an order of magnitude of cost savings (< $850K to produce - not including non-recurring costs) and substantial reductions in weight (<10lbs), power and volume without sacrificing capability.  This sensor payload will be developed for use on smaller Unmanned Aerial Systems (UASs).

 

DESCRIPTION: Airborne hyperspectral imaging (HSI) systems have historically required heavy and complex optical components, high power consumption, and large ancillary hardware to facilitate cooling, calibration, data collection, and data processing. These factors combine to limit the number of potential operating platforms capable of handling such payloads to larger aircraft, resulting in limited accessibility and availability.

 

PHASE I: This topic is only accepting Direct to Phase II (DP2) proposals for a cost up to $2,000,000 for a 24-month period of performance.

 

Proposers interested in submitting a DP2 proposal must provide documentation to substantiate that the scientific and technical merit and feasibility equivalent to a Phase I project has been met. Documentation can include data, reports, specific measurements, success criteria of a prototype, etc.

 

PHASE II: During Phase II, Firms should: (1) complete the sensor design, (2) fabricate, and test the component to show that it is ready for integration into a gimbal, (3) integrate into a gimbal for final integration onto a Class II or smaller UAS platform (4) refine the design as necessary and iteratively re-fabricate and re-test if appropriate, (5) validate sensor payload performance in the government run laboratory (6) define and document relevant interfaces to enable integration, (7) lay out a high-level plan for how your component could be integrated into a Class II or smaller UAS platform and explore possible partners to enable the transition plan if needed.

 

PHASE III DUAL USE APPLICATIONS: Integrate sensor/gimbal payload into prototype system for field collection. Deploy the sensor on at least one (1) test event to observe performance and generate quantitative/qualitative sensor performance data.

 

REFERENCES:

A. U. G. Sankararao, N. T. S. Kumar and P. Rajalakshmi, "Workflow and Calibration of Airborne Hyperspectral Imaging System," 2020 IEEE International Conference on Computing, Power and Communication Technologies (GUCON), Greater Noida, India, 2020, pp. 757-762, doi: 10.1109/GUCON48875.2020.9231236. URL: https://ieeexplore.ieee.org/document/9231236 
Y. Zhong et al., "Mini-UAV-Borne Hyperspectral Remote Sensing: From Observation and Processing to Applications," in IEEE Geoscience and Remote Sensing Magazine, vol. 6, no. 4, pp. 46-62, Dec. 2018, doi: 10.1109/MGRS.2018.2867592. URL: https://ieeexplore.ieee.org/document/8573977

 

KEYWORDS: Hyperspectral, VNIR, SWIR, LWIR

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