Enabling Metrology for Integrating Components in Advanced Packaging
ID: 3Type: BOTH
Overview

Topic

Enabling Metrology for Integrating Components in Advanced Packaging

Agency

Department of CommerceNational Institute of Standards and Technology

Program

Type: SBIRPhase: BOTHYear: 2024

Topic Link

https://www.sbir.gov/node/2609707

Additional Information

https://grants.gov/search-results-detail/353574
Timeline
  1. 1
    Release Apr 16, 2024 12:00 AM
  2. 2
    Open Apr 16, 2024 12:00 AM
  3. 3
    Next Submission Due Jun 14, 2024 12:00 AM
  4. 4
    Close Jun 14, 2024 12:00 AM
Description

The Department of Commerce, specifically the National Institute of Standards and Technology, is seeking proposals for the FY2024 Small Business Innovation Research (SBIR) Program for CHIPS for America – CHIPS Metrology. The topic of the solicitation is "Enabling Metrology for Integrating Components in Advanced Packaging."

This solicitation aims to support research and development projects that focus on developing metrology solutions for integrating components in advanced packaging. The technology or research being solicited will have applications in the field of advanced packaging, specifically in the area of metrology for integrating components.

The goal of this research is to enable the development of accurate and reliable measurement techniques and tools that can be used to assess the performance and reliability of integrated components in advanced packaging. The research should aim to address the challenges and limitations currently faced in this field and propose innovative solutions.

The project duration for this solicitation is not specified, but the application due date is June 14, 2024. Funding specifics are not provided in the document.

For more information and to access the solicitation, interested parties can visit the SBIR topic link (https://www.sbir.gov/node/2609707) or the solicitation agency URL (https://grants.gov/search-results-detail/353574). The solicitation is currently open for submissions.

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