Best Image Fusion for Circuit Card Assemblies
ID: AF244-D007Type: Phase II
Overview

Topic

Best Image Fusion for Circuit Card Assemblies

Agency

Agency: DODBranch: USAF

Program

Type: SBIRPhase: Phase II

Topic Link

https://www.dodsbirsttr.mil/topics-app/

Additional Information

https://www.dodsbirsttr.mil/topics-app/
Timeline
  1. 1
    Release Sep 4, 2024, 8:00 AM UTC
  2. 2
    Open Oct 2, 2024, 8:00 AM UTC
  3. 3
    Submission Due Nov 6, 2024, 12:00 PM UTC
  4. 4
    Close Nov 6, 2024, 12:00 PM UTC
Description

The United States Air Force (USAF) is seeking innovative solutions through the Small Business Innovation Research (SBIR) program to develop software for the fusion of images captured from various modalities, specifically for circuit card assemblies (CCAs). The objective is to create a tool that can combine images from different imaging techniques, such as X-Ray and Terahertz Imaging, to produce a comprehensive 3D volume of a CCA, free from artifacts like shadowing and beam hardening. This initiative is crucial for maintaining legacy avionics systems, as it enables effective reverse engineering of CCAs, which are vital components in avionics systems. The solicitation is currently open, with applications due by November 6, 2024. Interested parties can find more information and submit proposals through the official SBIR website at https://www.dodsbirsttr.mil/topics-app/.

Files
Title
Posted
1729929011565.pdf
Oct 28, 2024, 6:22 PM UTC
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