National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)
ID: 356762Type: Posted
Overview

Buyer

National Institute of Standards and Technology (DOC-NIST)

Eligible Applicants

Others

Funding Category

Science and Technology and other Research and Development

Funding Instrument

Other

Opportunity Category

Discretionary

Cost Sharing or Matching Requirement

Yes

Original Source

https://grants.gov/search-results-detail/356762
Timeline
    Description

    The National Institute of Standards and Technology (NIST) is offering a funding opportunity through the National Advanced Packaging Manufacturing Program (NAPMP) to support advanced packaging research and development (R&D) in the semiconductor industry. This initiative aims to foster domestic semiconductor advanced packaging capabilities by funding projects across five key areas: equipment and process integration, power delivery and thermal management, connector technologies, chiplets ecosystems, and electronic design automation. The program is critical for enhancing U.S. competitiveness in semiconductor manufacturing and addressing technological gaps essential for emerging technologies like artificial intelligence. Eligible applicants include domestic non-profit organizations, accredited higher education institutions, state and local governments, and for-profit entities, with funding amounts ranging from $10 million to $150 million per project. Interested parties must submit a detailed conceptual paper by December 20, 2024, and can direct inquiries to Misty L Roosa at research@chips.gov.

    Files
    Title
    Posted
    CHIPS.pdf
    The U.S. Department of Commerce is launching the National Advanced Packaging Manufacturing Program (NAPMP) to foster domestic semiconductor advanced packaging through $1.55 billion in funding for research and development (R&D) across five key areas: equipment and process integration, power and thermal management, connector technologies, chiplets ecosystems, and electronic design automation. The initiative aims to elevate U.S. competitiveness in semiconductor manufacturing and establish a skilled workforce over a five-year project period. Eligible applicants include non-profits, higher education institutions, and for-profit organizations based in the U.S. Funding per project can range from $10 million to $150 million. Proposals should demonstrate relevant technical advancements and educational contributions to workforce development. A detailed conceptual paper submission is required by December 20, 2024, followed by invited full applications. The program emphasizes collaboration across sectors and is designed to address pressing technological gaps in semiconductor packaging, aiming for a self-sustaining industry that supports innovations critical for emerging technologies like artificial intelligence. The NAPMP reflects a strategic government effort to strengthen the semiconductor supply chain and enhance national and economic security through advanced manufacturing capabilities.
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