H Department - Printed Circuit Boards and Bare Printed Circuit Boards, Electrical and Electronic Assemblies, Cards, and Associated Hardware
ID: N0017825Q4402Type: Combined Synopsis/Solicitation
Overview

Buyer

DEPT OF DEFENSEDEPT OF THE NAVYNSWC DAHLGRENDAHLGREN, VA, 22448-5154, USA

NAICS

Other Electronic Component Manufacturing (334419)

PSC

ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE (5998)

Original Source

https://sam.gov/opp/0e12128722ec401b803063b4bf76acbc/view
Timeline
    Description

    The Department of Defense, through the Naval Surface Warfare Center Dahlgren Division (NSWCDD), is seeking vendors to establish a Blanket Purchase Agreement (BPA) for the fabrication and delivery of Printed Circuit Boards (PCBs) and associated hardware. The procurement aims to meet the operational material needs of the Weapons Control and Integration Department, emphasizing the importance of high-quality, compliant electronic assemblies for defense applications. Vendors are required to demonstrate their technical capabilities and past performance, adhering to specific IPC and ISO standards, with submissions due by August 13, 2025. Interested parties can contact Chloe Inscoe at chloe.e.inscoe.civ@us.navy.mil or Carmell T. Beard at carmell.t.beard.civ@us.navy.mil for further information.

    Files
    Title
    Posted
    25Q4402_BPA_SOW.pdf
    The Statement of Work (SOW) outlines the responsibilities of contractors for the Weapons Control and Integration Department at the Naval Surface Warfare Center, Dahlgren Division. The primary goal is to fabricate, assemble, and deliver Printed and Bare Circuit Boards (PCBs) and related hardware under an accelerated schedule in compliance with specified government standards. Key tasks include ordering Bill of Material (BOM) components, fabricating and assembling PCBs, and providing quality assurance through compliance certification. The document mandates adherence to various IPC and ISO specifications for PCB production and electronic assemblies, emphasizing in-house manufacturing capabilities for specific board classes. It also details vendor performance criteria, stipulating that a vendor's acceptance rate must meet certain thresholds to maintain eligibility. Security aspects require all work to remain unclassified and compliant with NIST standards, along with ITAR regulations. The document highlights the need for U.S.-based operations and includes federal supply codes relevant to printed circuit boards and electronic assemblies. Overall, this SOW serves as a framework for contractors to provide essential PCB services within U.S. defense frameworks while ensuring quality and regulatory compliance.
    25Q4402_COMBINED SYNOPSIS BPA Final.pdf
    The document outlines the combined synopsis/solicitation N0017825Q4402 issued by the Naval Surface Warfare Center Dahlgren Division (NSWCDD) for potential vendors interested in establishing a Blanket Purchase Agreement (BPA) for Printed Circuit Boards. The solicitation is prepared under FAR Parts 12 and 13, inviting vendors to submit necessary documentation by 13 August 2025. It emphasizes the BPA's role as a streamlined, as-needed procurement method that does not constitute a formal contract. Vendors are requested to demonstrate their technical capability through detailed statements and provide past performance references. The submission must adhere to specific formatting guidelines and be sent electronically to designated contract specialists. The synopsis aims to foster a competitive environment while maintaining flexibility in vendor selection based on past performance, with no minimum government obligation. This initiative supports the operational material needs of the NSWCDD, which encompasses various fabrication resources.
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