H Department - Printed Circuit Boards and Bare Printed Circuit Boards, Electrical and Electronic Assemblies, Cards, and Associated Hardware
ID: N0017824Q4401Type: Sources Sought
Overview

Buyer

DEPT OF DEFENSEDEPT OF THE NAVYNSWC DAHLGRENDAHLGREN, VA, 22448-5154, USA

PSC

ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE (5998)

Original Source

https://sam.gov/opp/872d2a529e384c82a900bc9701232ba1/view
Timeline
    Description

    The Department of Defense, through the Naval Surface Warfare Center Dahlgren Division, is seeking proposals for a Firm Fixed Price Blanket Purchase Agreement (BPA) for the fabrication, assembly, and delivery of Printed and Bare Circuit Boards (PCBs) and associated hardware. Vendors are required to meet specific standards, including compliance with International Trafficking in Arms (ITAR) regulations and the National Institute of Standards and Technology (NIST) Special Publication 800-171 for data protection, with all work to be conducted within the United States. This procurement is crucial for supporting national defense technological advancements, and interested vendors must submit their proposals by October 9, 2024, while providing necessary documentation such as Cage Code, DUNS Numbers, and past performance references. For further inquiries, vendors can contact Chloe Inscoe at chloe.e.inscoe.civ@us.navy.mil or Amy Richards at Amy.Richards@navy.mil.

    Files
    Title
    Posted
    H Dept - PCB BPA - Sources Sought.pdf
    N0017824Q4401_Combined Synopsis Solicitation.pdf
    The document serves as a Combined Synopsis/Solicitation (N0017824Q4401) from the Naval Surface Warfare Center Dahlgren Division (NSWCDD) inviting vendors to submit proposals for Blanket Purchase Agreements (BPAs) related to Printed Circuit Boards. The anticipated publication for this request is September 25, 2024, with a closing date of October 9, 2024. The solicitation encourages responses from all business concerns, particularly those with past experience supplying electrical and electronic assemblies. Vendors must provide their Cage Code and DUNS Numbers for SAM verification, along with at least three past performance references detailing quality and delivery times. A technical capability statement is also required to demonstrate the vendor's ability to meet outlined requirements. BPAs will be awarded based on the submissions, and all orders will operate under firm fixed pricing. Delivery is to be made FOB Destination to Dahlgren, Virginia. The solicitation emphasizes that it is an informal call for proposals, not a formal RFP, and encourages interested parties to submit documentation by March 1, 2023. Overall, the notice seeks to streamline the acquisition process while ensuring the government can meet operational needs through a flexible vendor pool.
    N0017824Q4401_FINAL.pdf
    The document N0017824Q4401 details a Request for Proposal (RFP) from the Naval Surface Warfare Center, Dahlgren Division, for the fabrication, assembly, and delivery of Printed and Bare Circuit Boards (PCBs) and associated hardware. The contractor selected will work on an accelerated schedule and adhere to specific government standards and Technical Data Packages (TDP). The document outlines the contractor's responsibilities, including sourcing Bill of Material (BOM) components, fabricating PCBs according to government specifications, assembling components, and providing requisite certifications. Key industry standards cited include IPC specifications for PCB manufacturing and electrical testing. Quality control measures are emphasized, with vendor performance evaluated regularly. The document mandates that all work remains unclassified and that vendors comply with specific security standards, including the capacity to handle ITAR designs. Furthermore, the proposal must meet various regulatory clauses and provide assurance against organizational conflicts of interest, with a focus on small and veteran-owned businesses. This RFP illustrates the federal government's ongoing commitment to national defense-related technological advancements within a structured procurement framework.
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