Wafer Bonding System
ID: N0017324QMB23Type: Combined Synopsis/Solicitation
Overview

Buyer

DEPT OF DEFENSEDEPT OF THE NAVYNAVAL RESEARCH LABORATORYWASHINGTON, DC, 20375-5328, USA

NAICS

Analytical Laboratory Instrument Manufacturing (334516)

PSC

LABORATORY EQUIPMENT AND SUPPLIES (6640)

Original Source

https://sam.gov/opp/c13217cf6b294953a0ff55a5a9e0cd34/view
Timeline
    Description

    The Department of Defense, through the Naval Research Laboratory (NRL), is seeking proposals for a specialized wafer bonding system designed to bond semiconductor or glass wafers under ultra-high vacuum conditions. This procurement aims to enhance semiconductor processing capabilities at the NRL, with the system required to accommodate various wafer sizes (3”, 4”, and 6”) and incorporate advanced bonding methods, vacuum control, heating capabilities, and software integration for automatic process control. Proposals must be submitted by 12 PM EDT on September 27, 2024, with a focus on technical capability, past performance, and price reasonableness as evaluation criteria. Interested parties can contact Michael Broomfield at michael.h.broomfield.civ@us.navy.mil or call 202-875-9785 for further information.

    Point(s) of Contact
    Michael Broomfield
    (202) 875-9785
    michael.h.broomfield.civ@us.navy.mil
    Files
    Title
    Posted
    CSS N0017324QMB23_waferbondingsystem.pdf
    The document is a combined synopsis and solicitation for a Request for Quote (RFQ) from the Naval Research Laboratory (NRL) for a specialized wafer alignment and bonding system. This system will bond semiconductor or glass wafers in ultra-high vacuum conditions and must handle various wafer sizes (3”, 4”, and 6”). Key specifications include advanced bonding methods, vacuum control, heating capabilities, and integration with software for automatic process control. The solicitation emphasizes full and open competition, requiring that proposals be submitted by 12 PM EDT on September 27, 2024. Offerors must provide detailed documentation demonstrating compliance with the technical specifications, past performances, and price reasonableness. The evaluation criteria prioritize technical capability over past performance and pricing, indicating that proposals demonstrating a significant understanding of project requirements will be favored. Overall, this RFQ serves to procure a critical laboratory tool that enhances the capabilities of semiconductor processing at the NRL, aligning with federal guidelines for competitive government procurement.
    Lifecycle
    Title
    Type
    Wafer Bonding System
    Currently viewing
    Combined Synopsis/Solicitation
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