Die matrix expander for Automated Dicing Saw
Contract Opportunity Analysis
NASA's National Aeronautics and Space Administration (NASA) Shared Services Center is seeking quotes for a Die Matrix Expander for an Automated Dicing Saw, designated as a "Brand Name or Equal To" requirement. This equipment is crucial for the Smart Sensing and Electronics System branch at NASA Glenn Research Center, facilitating the release of sensors and electronics die from dicing tape post-dicing, which supports the development of silicon carbide integrated circuits and sensors for aerospace applications. The expander must accommodate wafers up to 8 inches and include features such as a temperature-controlled heated stage, programmable settings, and essential safety mechanisms. Quotes are due by August 14, 2025, at 7 a.m. CT, and interested vendors should contact Shanna Patterson at shanna.l.patterson@nasa.gov for further details, ensuring they reference tracking number 80NSSC25912022Q in their correspondence.