NASA Glenn Research Center (GRC) seeks a new Die Matrix Expander for its Smart Sensing and Electronics System branch at Lewis Field. This equipment is essential for releasing sensors and electronics die from dicing tape post-dicing, supporting the development of silicon carbide integrated circuits and sensors for aerospace applications. The required expander must be compatible with 6-inch and 8-inch wafer dicing film frames and accommodate wafers up to 8 inches (200mm). Key features include a temperature-controlled heated stage, programmable pre-heat time and ram speed, a motor-driven ram with adjustable stroke and digital speed control, and a motorized cutter assembly. Safety features such as an over-pressure sensor, slip clutch, emergency stop, and anti-static plexiglass shroud are also required. The unit must operate on 115 VAC 60Hz single-phase power and filtered, regulated air at 60 PSI.

The NASA Shared Services Center (NSSC) has issued Request for Quotation (RFQ) 80NSSC25912022Q for a die matrix expander for an automated dicing saw, designated as a "Brand Name or Equal To" requirement. This solicitation is set aside for small businesses, with quotes due by August 14, 2025, at 7 a.m. CT to Shanna Patterson at Shanna.l.Patterson@nasa.gov. The RFQ includes sections on the Statement of Work/Bid Schedule, Instructions to Offerors, Solicitation Provisions/Representations and Certifications, Clauses/Terms and Conditions, and Quote Evaluation Criteria. Bidders must include their CAGE/UEI Code, FOB Destination, Leadtime for Delivery, and POC Name & Email. All contractual and technical questions must be submitted in writing via email by August 13, 2025, at 7 a.m. CT. Offerors must be registered at www.sam.gov and complete specific provisions regarding telecommunications and video surveillance services/equipment.