Circuit Card Assembly
ID: SPRDL1-26-Q-0014Type: Solicitation
Overview

Buyer

DEPT OF DEFENSEDEFENSE LOGISTICS AGENCYDLA LAND WARRENWARREN, MI, 48397, USA

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

PSC

ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE (5998)

Set Aside

Total Small Business Set-Aside (FAR 19.5) (SBA)
Timeline
    Description

    The Department of Defense, through the Defense Logistics Agency (DLA) Land Warren, is soliciting offers for the procurement of Circuit Card Assemblies under solicitation SPRDL1-26-Q-0014. This opportunity is set aside for total small business competition and requires the supply of 37 production units, with an option for an additional 37 units, all under a Firm Fixed Price contract. The Circuit Card Assemblies are critical components used in various defense applications, and the procurement includes a mandatory First Article Test and Report, ensuring compliance with stringent quality standards. Interested vendors must submit their offers by February 13, 2026, and can access the Technical Data Package (TDP) via SAM.gov, provided they have a current DD 2345 agreement. For further inquiries, potential bidders can contact Michelle Stojkovski at michelle.stojkovski@dla.mil or Sabrina Krafft at sabrina.krafft@dla.mil.

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    Posted
    Amendment 0001 to solicitation SPRDL1-26-Q-0014 updates the Technical Data Package (TDP) link and extends the closing date for offers to February 13, 2026. This solicitation is for Firm Fixed Price contracts for Circuit Card Assembly, including a production quantity of 37 units and an unexercised option for an additional 37 units. A First Article Test and Report is also required. The TDP is accessible via SAM.gov, requiring vendors to have a current DD 2345 (Militarily Critical Technical Data Agreement) and a SAM.gov account registered through login.gov. Strict protocols for accessing and handling export-controlled TDPs are outlined, including destruction requirements. The document also details regulations for Engineering Change Proposals (ECPs) and Requests for Variances (RFVs), emphasizes the contractor's responsibility for shop drawings, and prohibits the use of Class I Ozone Depleting Substances (CIODS). It further restricts approved suppliers for Circuit Card Assemblies and Printed Circuit Boards within FSC 5998 to ensure supply chain traceability and compliance with US manufacturing regulations, requiring post-award traceability documentation and contracting officer approval prior to shipment.
    This Request for Quotation (RFQ) SPRDL1-26-Q-0014, issued by DLA Weapons Support (Warren), is a total small business set-aside for Circuit Card Assemblies (NSN: 5998-01-664-9529 and 5998-01-664-9629). It requires the supply of 37 production units and an unexercised option for an additional 37 units, both under a Firm Fixed Price contract. A First Article Test and Report is mandatory, with the cost included in the production quantity. All offers must be for the total quantity, and only one award will be made. Technical data packages (TDPs) are available on SAM.gov, requiring vendors to have a current DD 2345 (Militarily Critical Technical Data Agreement) for access. Submissions must be via email to the Contract Specialist by the specified closing date, with strict adherence to deadlines. Packaging must comply with MIL-STD-2073-1 and Special Packaging Instruction AK16649529, including military preservation and packing level B. Inspection and acceptance will occur at the origin, requiring contractor compliance with ISO 9001:2015 or equivalent quality standards and MIL-STD 1916. Deliveries are FOB Destination, with specific schedules for both production and first article test items. The use of Class I Ozone Depleting Substances (CIODS) is prohibited, and Class II ODS requires government approval. Contractors must provide supply chain traceability documentation and adhere to approved supplier restrictions for circuit card assemblies, ensuring no components are manufactured or assembled in Covered Nations.
    Lifecycle
    Title
    Type
    Circuit Card Assembly
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