Microelectronics Request for Information
ID: HDTRA126RFI-MicroelectronicsType: Sources Sought
Overview

Buyer

DEPT OF DEFENSEDEFENSE THREAT REDUCTION AGENCY (DTRA)DEFENSE THREAT REDUCTION AGENCYFORT BELVOIR, VA, 22060-6201, USA

NAICS

Computer Systems Design Services (541512)

PSC

NATIONAL DEFENSE R&D SERVICES; DEFENSE-RELATED ACTIVITIES; APPLIED RESEARCH (AC32)

Set Aside

No Set aside used (NONE)

Original Source

https://sam.gov/workspace/contract/opp/219420abbe5b4e1fb86d5c766c9f9854/view
Timeline
    Description

    The Defense Threat Reduction Agency (DTRA) is issuing a Request for Information (RFI) to identify innovative microelectronic materials that can achieve low size, weight, power, and cost (SWaP-C) for advanced sensor applications. The RFI seeks information on the development of hybrid materials and semiconductors, including new or significantly improved 2D materials, flexible alternatives to traditional chips, and robust, heat-resistant components that can withstand adverse environmental conditions. This initiative is crucial for enhancing sensor design and functionality, ultimately benefiting the General Forces by improving operational efficiency. Interested parties must submit a 5-page white paper and a 10-slide PowerPoint presentation by January 26, 2026, at 1700 EST, and can direct inquiries to Dr. Jennifer Soliz at jennifer.r.soliz.civ@mail.mil.

    Point(s) of Contact
    Dr. Jennifer Soliz
    jennifer.r.soliz.civ@mail.mil
    Files
    Title
    Posted
    Microelectronics_RFI_Final.pdf
    The Defense Threat Reduction Agency (DTRA) Research and Development Directorate (RD) Chemical and Biological Technologies Directorate, in support of the Joint Program Executive Office for Chemical, Biological, Radiological, Nuclear Defense (JPEO-CBRND), is issuing a Request for Information (RFI) to gather details on innovative fusion of diverse components for high-performing microelectronics. The goal is to develop hybrid materials and semiconductors that reduce size, weight, power, and cost (SWaP-C) for microelectronics, thereby revolutionizing sensor design and enhancing functionality. The RFI seeks information on new or significantly improved 2D material capabilities, flexible materials to replace traditional chips, vertical integration of stackable materials, and agile, robust, heat-resistant chips and components. Preferred characteristics include sustainability in adverse environmental conditions (-30°C to 50°C, 10-95% RH), ruggedization (MIL-STD-810H), flexibility for textile integration, integration with microsensors, and low SWaP-C. Responders should demonstrate an understanding of material limitations, compare their technology to the current state-of-the-art, and address scalability. This RFI is for planning purposes only and does not constitute a commitment to procure. Responses, due by January 26, 2026, at 1700 EST, should include a 5-page white paper and a 10-slide PowerPoint presentation, providing a rough order of magnitude (ROM) cost estimate for 1-3 years of S&T development and 3-4 years of projected advanced development.
    Lifecycle
    Title
    Type
    Microelectronics Request for Information
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