BioElectronics to Sense and Treat (BEST)
Contract Opportunity Analysis
The Department of Defense, through the Defense Advanced Research Projects Agency (DARPA), is seeking proposals for the BioElectronics to Sense and Treat (BEST) program, which aims to develop an automated bioelectronic smart bandage for managing wound infections in military settings. The program's objectives include creating a device that can continuously monitor wounds, predict infections, and autonomously administer treatments, thereby enhancing military medical care and potentially benefiting civilian healthcare. DARPA has allocated approximately $22.8 million for multiple awards, with full proposals due by May 8, 2025, and key milestones including an Industry Day on February 19, 2025, and abstract submissions by March 25, 2025. Interested parties can contact Dr. Leonard Tender at BEST@darpa.mil for further information.