Soldier Thermal Infrared Signature Management Industry Day
ID: SEP_ID_2024Type: Special Notice
Overview

Buyer

DEPT OF DEFENSEDEPT OF THE ARMYW6QK ACC-APG NATICKNATICK, MA, 01760-5011, USA

NAICS

Apparel ManufacturingT (315)
Timeline
    Description

    The Department of Defense, specifically the Department of the Army, is hosting a Soldier Thermal Infrared Signature Management Industry Day on September 23, 2024, in Springfield, Virginia. This event aims to connect with potential partners from both small and large businesses to discuss advancements in Soldier signature management and to share findings from the recent Soldier Enhancement Project. The Industry Day is crucial for fostering collaboration between the Army and industry stakeholders to enhance soldier equipment, focusing on camouflage, concealment, and deception capabilities. Interested companies must register by September 16, 2024, by emailing Nathan Heslink at nathan.g.heslink.civ@army.mil, and are encouraged to prepare a quad chart outlining their capabilities for potential one-on-one meetings with Army subject matter experts.

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    Title
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    The U.S. Army DEVCOM Soldier Center is hosting an Industry Day in 2024 focused on Soldier Clothing and Individual Equipment, inviting companies to present their capabilities and products. Participants are required to outline key performance metrics, features, and manufacturing readiness, including capacity levels and limitations. Companies must provide point-of-contact information, including names, titles, emails, and phone numbers, to facilitate further communication. Additionally, relevant company background information is to be included to contextualize the presented capabilities. The aim of the Industry Day is to explore innovative solutions for soldier equipment, fostering partnerships between the Army and industry stakeholders. This initiative reflects the Army's commitment to enhancing soldier gear through collaboration with private sector manufacturers.
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