Wafer Grinder and CMP Tools
ID: N0017325QMB04Type: Combined Synopsis/Solicitation
Overview

Buyer

DEPT OF DEFENSEDEPT OF THE NAVYNAVAL RESEARCH LABORATORYWASHINGTON, DC, 20375-5328, USA

NAICS

Semiconductor Machinery Manufacturing (333242)

PSC

SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY (3670)

Set Aside

Total Small Business Set-Aside (FAR 19.5) (SBA)

Original Source

https://sam.gov/opp/f75cfb47567a4fbcb4bb05a123c21300/view
Timeline
    Description

    The Department of Defense, through the Naval Research Laboratory, is seeking proposals for the procurement of Wafer Grinder and Chemical Mechanical Polisher (CMP) tools under solicitation number N00173-25-Q-MB04. The primary objective is to acquire commercially available grinding systems capable of processing semiconductor substrates, specifically silicon carbide (SiC) wafers, with precise control over thickness and surface finish, while accommodating wafer diameters between 75 mm and 150 mm. These tools are critical for research and development in semiconductor manufacturing, ensuring minimal total thickness variation and high-quality surface results. Interested small businesses must submit their quotes by February 14, 2025, and can direct inquiries to Michael Broomfield at michael.h.broomfield.civ@us.navy.mil or by phone at 202-875-9785.

    Point(s) of Contact
    Michael Broomfield
    (202) 875-9785
    michael.h.broomfield.civ@us.navy.mil
    Files
    Title
    Posted
    CSS N0017325RMB04_wafergrinder.pdf
    The solicitation N00173-25-Q-MB04 is a Request for Quote (RFQ) from the U.S. Navy seeking vendors for a Wafer Grinder and Chemical Mechanical Polisher (CMP) Tool. The equipment must remove up to 345 µm of semiconductor substrates from wafers ranging from 75 mm to 150 mm in diameter while ensuring low surface roughness and high precision in thickness variation. This solicitation is open to all qualifying businesses but is set aside for total small business participation. Proposals must be submitted by February 7, 2025, and all interested vendors must be registered in the System for Award Management (SAM). The evaluation of proposals will consider technical capability, past performance, and price. Vendors are required to show compliance with specific technical specifications, provide company information, warranties, and any necessary authorizations to sell the equipment. The contract will be a Firm-Fixed-Price (FFP) Purchase Order with equipment delivery required within six months from the award date. This solicitation underscores the government's focus on enhancing semiconductor manufacturing capabilities while ensuring compliance with federal regulations.
    CSS N0017325RMB0401_wafergrinder.pdf
    The document is a combined synopsis/solicitation for the procurement of a Wafer Grinder and Chemical Mechanical Polisher (CMP) tool, issued under solicitation number N00173-25-Q-MB04. It is a full and open competitive Request for Quote (RFQ) per FAR Subpart 13.5, targeting firms registered in the System for Award Management (SAM). Key requirements include commercially available grinding systems capable of handling semiconductor substrates up to 345 µm thick for wafer diameters between 75 mm and 150 mm, ensuring low total thickness variation. The offeror must submit quotes with detailed compliance documentation, including company information, warranty terms, and, if applicable, authorization as a reseller of the proposed equipment. The government will evaluate submissions based on technical capability, past performance, and price, using a Price/Technical Tradeoff analysis. Proposals must meet all specifications, with evaluation ratings ranging from Superior to Unacceptable, based on compliance with the requirements. Statements regarding the terms and conditions of the contract must be included in the quotes, along with assurances that no 'gray market' items will be provided. The deadline for quotes is set for February 14, 2025, with delivery required within six months of award. Overall, this solicitation exemplifies a structured approach to sourcing specialized semiconductor manufacturing equipment, ensuring compliance and quality through rigorous evaluation and documentation.
    Grinder and CMP Tool Specifications_Attachment 1.pdf
    The document outlines the specifications for a Wafer Grinder and Chemical Mechanical Polisher (CMP) tool, required for semiconductor substrate processing. Code 6880 calls for tools capable of grinding and polishing SiC wafers, with a focus on achieving minimal total thickness variation (TTV) and low surface roughness. Key requirements include the ability to grind and polish wafers between 75 mm and 150 mm, with demonstrated precision in thickness control and surface finish. Specific contractual obligations include the demonstration of processing specific wafer stacks and the capability of the grinder to remove significant amounts of substrate material. The CMP process must ensure uniform results and cleanliness through features like pressure balancing and slurry delivery systems. Additionally, the contractor must provide installation support and warranty coverage. This document serves as part of a government Request for Proposal (RFP), detailing necessary equipment and capabilities for prospective contractors, ensuring compliance with high industry standards in semiconductor manufacturing.
    Lifecycle
    Title
    Type
    Wafer Grinder and CMP Tools
    Currently viewing
    Combined Synopsis/Solicitation
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