Microelectronics Systems Integration Indefinite Delivery/Indefinite Quantity (IDIQ)
ID: HQ072725RSW01Type: Combined Synopsis/Solicitation
Overview

Buyer

DEPT OF DEFENSEDEFENSE MICROELECTRONICS ACTIVITY (DMEA)DEFENSE MICROELECTRONICS ACTIVITYMCCLELLAN, CA, 956522100, USA

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

PSC

ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE (5998)

Set Aside

Total Small Business Set-Aside (FAR 19.5) (SBA)

Original Source

https://sam.gov/workspace/contract/opp/8cf409424adc4a0d93683c38faa9919f/view
Timeline
    Description

    The Department of Defense, through the Defense Microelectronics Activity (DMEA), is seeking proposals for a single Indefinite Delivery/Indefinite Quantity (IDIQ) contract focused on Microelectronics Systems Integration services. This procurement aims to secure capabilities in the fabrication, component procurement, and assembly of microelectronic systems, with a strong emphasis on in-house capabilities for PCB assembly, cleaning, repair, and programming/testing. The opportunity is a total small business set-aside under NAICS code 334418, with a minimum order guarantee of $2,500 during the base period. Proposals are due by 2:00 PM (Pacific) on October 31, 2025, and interested vendors should direct inquiries to Shawndae Wilkins at shawndae.e.wilkins.civ@mail.mil.

    Point(s) of Contact
    Shawndae Wilkins
    (279) 782-8627
    shawndae.e.wilkins.civ@mail.mil
    Files
    Title
    Posted
    25-5E1 PWS Microelectronics Systems Integration IDIQ Redacted.pdf
    The Defense Microelectronics Activity (DMEA) seeks a contractor for comprehensive Microelectronics Systems Integration through an Indefinite Delivery/Indefinite Quantity (IDIQ) contract. This covers full turn-key solutions for developmental, prototype, and production electronics systems for Department of Defense (DoD) programs. Services include PCB fabrication, component procurement, PCB assembly, cleaning, coating, rework/repair, mechanical component manufacturing, automated testing, burn-in/environmental screening, and microelectronics system integration/assembly. The contractor must have in-house capabilities for PCB assembly, cleaning, repair, and programming/acceptance testing, and propose a plan for at least six other specified tasks, allowing for approved sub-contracting. The government will provide necessary resources such as engineering drawings, material lists (BOM, GFM), technical data packages (TDPs), and potentially Government Furnished Equipment (GFE) and Information (GFI). All excess materials and government-furnished items must be returned to DMEA upon project completion, and detailed technical and quality assurance reports are required.
    25-5E1 PWS Microelectronics Systems Integration IDIQ 6October2025 Redacted.pdf
    This government file outlines the comprehensive requirements for contractors involved in the manufacturing and integration of Microelectronics Systems. It details the conditions for Government Furnished Material (GFM), Equipment (GFE), and Information (GFI), including safeguarding, distribution, and return or destruction protocols. The core requirements cover manufacturing, fabrication, procurement, assembly, testing, and integration, emphasizing in-house capabilities for PCB Assembly, cleaning, repair, and programming/acceptance testing. Contractors must also propose plans for at least six additional tasks, such as PCB fabrication, component procurement, CCA coating, cable/harness assembly, mechanical sub-component fabrication, microelectronic system assembly, environmental testing, burn-in, kitting/packing/shipping, and manufacturability reviews. The document specifies adherence to industry standards (IPC, J-STD, MIL-STD), outlines technical reporting needs, and mandates DMEA approval for all subcontractors and alternative components. Data Item Descriptions (CDRLs) for various technical reports are also provided, detailing submission requirements and distribution statements for sensitive information.
    PWS 25-5E1 Combined Synopsis and Solicitation UPDATED 15OCT25.pdf
    This DMEA combined synopsis/solicitation, HQ072725RSW01, is for a single Indefinite Delivery/Indefinite Quantity (IDIQ) contract for microelectronics systems integration services. It is a 100% small business set-aside under NAICS code 334418. Proposals are due by 2:00 PM (Pacific) on October 31, 2025, to Contract Specialist Shawndae Wilkins at shawndae.e.wilkins.civ@mail.mil. Evaluation will prioritize technical capability and past performance equally, with technical proposals limited to five pages. The government guarantees a minimum order value of $2,500. Numerous FAR and DFARS clauses are incorporated, including those related to System for Award Management, commercial items, and small business set-asides. Interested offerors should contact Shawndae Wilkins for any questions.
    PWS 25-5E1 Combined Synopsis and Solicitation.pdf
    DMEA is seeking proposals for a single Indefinite Delivery/Indefinite Quantity (IDIQ) contract for Microelectronics Systems Integration services (Solicitation No.: HQ072725RSW01). This 100% small business set-aside will involve the selected offeror submitting proposals for individual Statements of Work throughout the ordering period. Proposals are due by 2:00 PM (Pacific) on October 16, 2025, via email to Shawndae Wilkins (shawndae.e.wilkins.civ@mail.mil). Evaluation will prioritize Technical Capability and Past Performance equally. Technical proposals are limited to 5 pages and must demonstrate understanding of requirements, a sound technical approach, in-house capabilities for PCB assembly, cleaning, repair, and microelectronic system programming/testing, and a plan for at least 6 of 10 manufacturing and integration tasks. Past performance on recent (within 3 years) and relevant contracts will be assessed. The government guarantees a minimum order of $2,500 during the base period. Various FAR and DFARS clauses apply, with specific deviations noted.
    Questions Set 1 23 SEP 25.pdf
    The document addresses questions from potential contractors regarding an Indefinite Delivery/Indefinite Quantity (IDIQ) contract. Key clarifications include the redaction of contact information in the PWS to prevent unauthorized communication, the absence of pricing instructions in the RFP due to pricing being addressed at the task order level, and confirmation that this is a new, single-award IDIQ with no incumbent. The place of performance will be the contractor's facility, with products shipped to a designated location. This document aims to clarify the terms and conditions for prospective bidders on a new federal government IDIQ contract.
    Questions Set 2 25 SEP 25.pdf
    This document clarifies fabrication and assembly standards for a government project, likely an RFP or grant. It addresses a question regarding whether fabrication should be Class 3 and assembly Class 2. The response confirms that Class 3 is the default standard for both fabrication and assembly, unless explicitly stated otherwise in the Technical Data Package (TDP). This ensures consistent quality and compliance for both processes.
    Questions Set 3 7 OCT 25.pdf
    This document, part of a government Request for Proposal (RFP), clarifies two key aspects for potential vendors. Firstly, regarding microelectronics support, the agency is not specifically seeking wire-bonding or other die-connect technologies, but vendors possessing these capabilities would be viewed favorably. Secondly, while ITAR/EAR99 compliance is not mandatory, vendors with this certification may be considered for a broader range of projects, indicating it adds value to their proposal. The document aims to provide clarity on technical requirements and desired vendor qualifications to help shape more competitive proposals.
    Questions Set 4 - 27 OCT 25.pdf
    This document clarifies two key aspects of a government Request for Proposal (RFP) or similar solicitation. Firstly, it specifies the requirements for Microelectronics Systems Manufacturing and Integration tasks. Out of 14 enumerated tasks (Sections 3.1.1 to 3.1.14), four are mandatory: 3.1.3, 3.1.4, 3.1.8, and 3.1.9. Vendors must include at least six of the remaining ten tasks in their proposals, with the option to omit or not bid on up to four, or to propose all 14. Secondly, the document clarifies that past performance documentation does not count towards the 5-page limit for the technical proposal, as they are considered separate documents.
    Lifecycle
    Title
    Type
    Microelectronics Systems Integration Indefinite Delivery/Indefinite Quantity (IDIQ)
    Currently viewing
    Combined Synopsis/Solicitation
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