Additive Manufacturing for Circuitry

Additive Manufacturing for Circuitry

ID: A254-043Type: BOTH

Overview

Topic

Additive Manufacturing for Circuitry

Agency

Agency: DODBranch: ARMY

Program

Type: SBIRPhase: BOTH

Topic Link

https://www.dodsbirsttr.mil/topics-app/

Additional Information

https://www.dodsbirsttr.mil/topics-app/

Timeline

Description

The Department of Defense, specifically the Army, is seeking proposals for the Small Business Innovation Research (SBIR) program focused on "Additive Manufacturing for Circuitry." The objective is to develop open-source machine controller software and custom 3D printing toolheads that facilitate the fabrication and repair of printed circuit boards (PCBs), enhancing existing 3D printers to support these capabilities. This initiative is crucial for addressing obsolescence issues in electronics and ensuring a resilient supply chain by enabling rapid design, repair, and replacement of components. Phase I proposals are invited with a funding amount of up to $250,000 for a six-month performance period, with the application due date set for July 23, 2025. Interested parties can find more information and submit proposals through the official SBIR website.

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