Radiation Hardening of Non-Hardened Commercial Microelectronics
SBIR Opportunity Analysis
The Department of Defense Missile Defense Agency is seeking proposals to develop a process for radiation hardening commercial, non-hardened microelectronics to operate in space environments. Awardees must utilize advanced heterogeneous packaging techniques to pair high-performance commercial off-the-shelf components, such as sub-16nm FinFETs or Gate All Around technologies, with slower, radiation-hardened components. This initiative targets a minimum Single Event Latch-up immunity of 75 Linear Energy Transfer and a Total Ionizing Dose survival of 300 kRad(Si) without relying on shielding or foundry-level mask changes. Due to the sensitive nature of this technology, the project is restricted under ITAR and EAR export control regulations and requires a Cybersecurity Maturity Model Certification Level 1. Proposals for this pre-release SBIR opportunity under solicitation 26.BZ may be submitted between July 22, 2026, and August 19, 2026.