Radiation Hardening of Non-Hardened Commercial Microelectronics
SBIR Opportunity Analysis
The Missile Defense Agency is seeking proposals under a Small Business Innovation Research opportunity to develop a process for radiation hardening commercial, non-hardened microelectronics for space environments. The required work involves utilizing advanced heterogeneous packaging techniques to integrate high-performance Commercial Off-The-Shelf components, such as sub-16nm FinFETs or Gate All Around technologies, with slower radiation-hardened chiplets. Solutions must not rely on shielding or foundry-level mask changes, and the final products must achieve a minimum Single Event Latch-up immunity of 75 Linear Energy Transfer and survive a Total Ionizing Dose of at least 300 kRad(Si). This project is restricted under ITAR and EAR export control regulations, requires a Cybersecurity Maturity Model Certification Level 1, and progresses from Phase I feasibility studies to Phase II prototype fabrication. The application deadline for this opportunity is August 19, 2026.