SBIRPre-Release

Bulk growth of InAsP crystal

Solicitation ID26.BZ
Agency
DOD
USAF
Deadline
Jun 24, 2026
45 days left
Posted Date
May 6, 2026
Classification
SBIR
Phase: Phase II

SBIR Opportunity Analysis

The U.S. Air Force, through DoD SBIR topic DAF26BZ02-DV012, seeks to develop a domestic source of high optical quality, compositionally uniform bulk InAsP wafers for short-wave infrared detector applications. The work calls for growing ternary semiconductor crystals that can produce wafers about 20 to 25 mm across and more than 1 mm thick, with several crack- and twin-free wafers yielded from each crystal boule. Key technical goals include strong compositional uniformity, minimal defects, desired band gap energy, and methods to prevent alloy segregation during growth, and the topic is restricted under ITAR and EAR with foreign national disclosure required. The topic is in pre-release, opens May 27, 2026, and closes June 24, 2026 at 4:00 PM.

SBIR Documents

1 Files
1778457813045.pdf
PDF50 KBMay 11, 2026
AI Summary
The DAF26BZ02-DV012 RFP seeks to develop a domestic source for high optical quality, compositionally uniform wafers of the ternary semiconductor alloy InAsP. This technology is restricted under ITAR and EAR, requiring disclosure of foreign national involvement. The objective is to produce 20-25 mm cross-section, >1 mm thick InAsP wafers for short-wave infrared detectors. As a Direct-to-Phase-II (D2P2) topic, applicants must demonstrate prior experience in bulk ternary alloy crystal growth. Phase II will focus on delivering crack- and twin-free wafers with high compositional uniformity, minimal defects, and desired band gap energy, while preventing alloy segregation. Phase III will commercialize these technologies for government and civilian dual-use applications.

Related SBIR/STTR Opportunities

Opportunity Snapshot

Source SystemOfficial Link
Program Type
SBIR - Phase II
Agency
DOD / USAF

Key Dates

Release DateMay 6, 2026
Open DateMay 27, 2026
Application DueJun 24, 2026
Close DateJun 24, 2026