Photonic-electronic Panels Integration (PEPI)

The DPA26BZ01-NV002 RFP seeks to develop Photonic-electronic Panels Integration (PEPI) technology, extending DARPA's Heterogeneous Adaptively Produced Photonic Interfaces (HAPPI) program. The objective is to create a prototype for photonic-electronic panels that integrate photonic chips with high-density three-dimensional optical routing, enabling dense connectivity and seamless co-integration of optical and electrical interconnections. This technology aims to be a manufacturable, commercially available, low-cost platform for multi-chip integration. Phase I focuses on designing and demonstrating a prototype panel with specific optical interconnect pitch, a >16 channel detachable fiber attach unit (FAU), and the integration of at least two integrated circuits (ICs) capable of routing both optical and electronic signals, meeting a defined optical link budget and demonstrating built-in optical loopback. Phase II involves the fabrication and assembly of these designs, delivering ten self-contained, environmentally robust panel prototype units with detailed documentation and characterization data. Phase III envisions dual-use applications, with commercial opportunities for panel-sized interposers enabling PIC interconnectivity with external systems, and Department of War applications in high-performance co-packaged optical systems for computing, signal processing, sensor arrays, and high-bandwidth communication modules.