The Department of Defense, through the Office of the Secretary of Defense, is seeking quantum sensing capabilities that are size, weight, and power compatible with a broad range of vehicles and platforms under SBIR solicitation 26.BZ. Performers must design and develop one or more multicomponent prototypes realizing a commercially viable quantum-sensor-related component in an integrated module. Proposed designs should leverage technologies such as photonic integrated circuits, microcells, and solid-state technologies to mitigate integration and manufacturing risks while reducing overall sensor size, weight, and power. This opportunity is accepting both Phase I and Direct to Phase II proposals, with applications due by August 19, 2026, at 4:00 PM Eastern Time.

## Description

The DoW needs quantum sensing capabilities that are Size, Weight, and Power (SWaP) compatible with a broad range of vehicles and platforms, and it seeks to develop commercial, off-the-shelf (COTS) components with integrated capabilities that currently hinder low-SWAP quantum sensors. Such COTS components could provide multiple advantages:<ul><li>Integrating capability for use in different sensor designs across the quantum industry</li><li>Accelerating the development of low SWaP, low-cost quantum sensors by focusing resources on COTS solutions that currently hinder such development from custom, discrete approaches</li><li>Expanding dual-use market opportunities through commercial application of such COTS components individually and by enabling quantum sensors with more attractive price points for commercial markets</li><li>Providing initial steps needed for eventual standardization of quantum technologies and quantum support devices targeting the most mature quantum technology currently available, i.e., quantum sensors</li><li>Attracting non-quantum commercial companies to leverage their expertise in microelectronic device manufacturing</li></ul>Proposed approaches should target capabilities needed for supporting quantum device operation broadly needed in the quantum sensor community with the result of lowering overall SWaP and cost of such sensors. They should carefully consider the expected market potential for selling the resulting component to the quantum community and potentially beyond to non-quantum DoW and commercial markets. The mix of component technologies that enable quantum devices should account for such market potential and be key elements in reducing the SWAP of overall quantum sensors.Proposed solutions could leverage, but they are not limited to, photonic integrated circuits (PICs), microcells, and solid-state technologies like color centers, silicon nitride (SiN), and thin film lithium niobate (TFLN) to enable the production of compact and robust light sources, isolators, modulators, and other components used to realize quantum sensing, computing, and networking capabilities. These components are still largely produced in isolation, incurring performance losses due to interfacing issues such as fiber insertion loss or reflection at waveguide facets. Directly integrating these components onto (e.g.) a single substrate can reduce the losses resulting from internal interfaces and enable reduced form-factors, but they must balance a need for the modularity that enables reuse and accelerates innovation.

## Objective

Develop one or more multicomponent prototypes realizing a commercially viable quantum-sensor-related component in an integrated module.

## Phase I

Phase I efforts should develop a design for an integrated multicomponent COTS module that mitigates risk associated with component integration and manufacture. The design should mitigate the risk of integrating the individual components as well as manufacturing the module, with alignment to facilities focused on commercial products versus research use. The design should be documented in a detailed technical report alongside performance modeling or simulated performance of the proposed integrated components, as well as that of a manually integrated equivalent using state-of-the-art discrete components. Module key performance parameters relevant to one or more quantum sensing applications should be identified in collaboration with the government. The performance of the proposed module in these key performance parameters should be compared to that of a discrete-component approach, alongside expected performance impacts in the identified quantum application(s). Expected SWaP reductions in quantum sensors and identified market potential of the resulting device will be key elements of the progress of this phase, and it will be used in evaluating the progression of the effort to the next phase. Proposals elucidating initial paths and necessary development to achieve volume manufacturing of the final COTS device are especially encouraged.Proposals should specify the level of integration necessary based on application and market demand. Individual components to be integrated must already be sufficiently mature (e.g. Technology Readiness Level 4-5, or have accepted design criteria). The designed prototype must have an immediate quantum sensor application but should also enable being rapidly integrated into non-quantum applications. The designed prototype should be shown to meet or exceed the performance of equivalent manually-integrated state-of-the-art components as modeled and/or simulated.This topic is accepting both Phase I and Direct to Phase II (DP2) proposals. Proposers interested in submitting a DP2 proposal must provide documentation to substantiate that the scientific and technical merit and feasibility described above has been met and describe the potential commercial applications. DP2 documentation may include: technical reports describing results and conclusions of existing work; presentation materials and/or white papers; technical papers; test and measurement data; prototype designs/models.

## Phase II

Phase II will focus on the production of a prototype as per the Phase I design, and the characterization and evaluation of the produced prototype. In Phase II the performer will build one or more working prototypes agreeing with modeled or simulated performance from Phase I. Phase II reporting should include characterization of the prototype(s) in terms of key performance parameters updated from those identified in Phase I and validation of the prototype(s) against updated manufacturing and integration risk mitigations from Phase I. The prototype produced must be self-contained and/or the adjacent components to support operation, evaluation, and characterization must be available, along with benchmark specifications for device performance. Optionally, the prototype could be physically integrated into a quantum sensing, computing, or networking device, and performance, including overall SWAP reductions, characterized. Optionally, a module manually-assembled from state-of-the-art components could be characterized and compared to the prototype module. The prototype is expected to meet or exceed the performance of manually-integrated components as modeled and/or simulated in Phase I or optionally built in Phase II.Performers should show clear progress towards manufacturing and selling the resulting COTS component to one or more external vendors. Such vendors could include other quantum-related companies, companies supporting other DoW applications, or companies unrelated to either. Progress can include letters of interest from such vendors, plans for integration into designs from external DoW or commercial entities, detailed analyses of the feasibility of displacing existing sensors or components, and so on. Providers are required to provide a defensible and progressive path to costing and market feasibility of the COTS component for use by external commercial vendors given any unknown limitations in realizing such a path. Progress towards volume manufacturing and resulting cost reductions should be shown. Leveraging of commercial manufacturing vendors is encouraged, although not necessary given sufficient justification for the proposed business path of the resulting COTS device. Proposers are invited to consider use of the Microelectronic (ME) Commons fabrication and packaging capabilities to broaden device exploration. Success of a primary COTS effort should not depend on the use of the ME Commons, however, as securing such capability is not guaranteed by being selected for this SBIR. Proposers are further not required to use the ME Commons, and no special consideration or favor will be given to proposals that include the use of the ME Commons.

## Phase III: Dual Use Applications

The work in Phases I and II should provide a compelling path to move the component towards commercial viability within 12 months, pending production of the updated technical data packages required to drive manufacturing at scale. The prototype outcomes of this project are expected to have utility in both DoW and non-DoW applications. DoW applications should have quantum sensing as a primary one, but they can also include non-quantum solutions via programs focused on the rapid transition of technologies into fielded devices and systems.

Integrated Multicomponent Module for Quantum Sensors

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