xTech|Kinetic Reach Competition

The DPA26TZ03-DV002 initiative seeks to develop flexible, polymer-matrix thermal interface materials (TIMs) with tunable thermal and mechanical properties. This project aims to leverage hierarchical, biocomposite-based microstructures for scalable, sustainable, and low-cost thermal management in high-performance electronics and power applications. The objective is to address challenges in dissipating heat from high-density microelectronics and power storage systems, particularly in applications like drones and electric vehicles where traditional TIMs face limitations in thermal conductivity, aging, and reliability.The project is structured as a Direct to Phase II (DP2) solicitation, requiring proposers to demonstrate prior feasibility equivalent to a Phase I effort. Phase II focuses on developing and demonstrating scalable biomanufacturing of biocomposite filler-type TIMs with thermal conductivity exceeding 23 W/m-K, tunable mechanical properties, and stable performance after bending cycles. These TIMs must also exhibit sufficient adhesion and flexibility comparable to common elastomers. Demonstrations will involve prototype systems in operational environments, such as passively-cooled battery packs in drones or electric vehicles, or high-TDP CPUs/GPUs. The goal is to show a statistically significant reduction in device temperature compared to standard TIMs. Phase II also emphasizes commercialization and transition planning, including collaboration with end-users and the development of manufacturing and scaling plans.Dual-use applications for these biocomposite TIMs include military drones, soldier-worn power systems, ground vehicle power electronics, and directed-energy thermal management, as well as commercial applications such as delivery drones, EV battery packs, data center GPUs/CPUs, and LED lighting.