3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
SBIR Opportunity Analysis
The Navy, through the Department of Defense SBIR program, is seeking a 3D-heterogeneously integrated photonic imaging sensor to improve high-bandwidth electro-optical and infrared sensing. The work covers a detector array, read-out integrated circuit, and photonic transmitter designed to replace copper interconnect bottlenecks with optical interconnects and support high-resolution, wide-field-of-view, high-frame-rate imaging. Phase I calls for a trade study and conceptual design supported by quantitative modeling, noise and link analyses, and a Phase II fabrication and integration plan; Phase II then calls for a prototype that can be documented through performance testing and that is compatible with tiled arrays and cryogenic operation. The solicitation opened May 6, 2026 and the proposal due date is June 3, 2026 at 4:00 PM ET under solicitation DON26BZ01-NV024.