TEMPERATURE-HARDENED ELECTRONICS FOR RELIABLE MISSION-CRITICAL APPLICATIONS (THERMAL)

DARPA is soliciting proposals for the TEMPERATURE-HARDENED ELECTRONICS FOR RELIABLE MISSION-CRITICAL APPLICATIONS (THERMAL) project, an SBIR opportunity to develop manufacturable mixed-signal integrated circuits (ICs) capable of reliable operation in harsh, high-temperature environments up to 800°C. This initiative addresses the limitations of conventional silicon-based technologies and current wide-bandgap materials like SiC and GaN, which lack the speed, stability, and manufacturability for widespread deployment in defense, aerospace, and energy applications. The objective is to establish a scalable wafer-based fabrication process for high-speed, thermally resilient mixed-signal ICs. Phase I focuses on demonstrating design feasibility through modeling and simulation, with experimental validation of amplifier and ring oscillator performance at 800°C. Phase II aims to demonstrate an Analog-to-Digital Converter (ADC) capable of stable 800°C operation and mature the wafer fabrication process for scalability. Phase III involves commercializing the technology for dual-use applications, improving operating lifetime, and finalizing a Process-Design Kit (PDK) for standardized fabrication and broad adoption.