TEMPERATURE-HARDENED ELECTRONICS FOR RELIABLE MISSION-CRITICAL APPLICATIONS (THERMAL)
SBIR Opportunity Analysis
The Defense Advanced Research Projects Agency is soliciting proposals under a Small Business Innovation Research opportunity to develop a scalable, wafer-based fabrication process for high-speed, mixed-signal integrated circuits capable of reliable operation in extreme environments up to 800 degrees Celsius. In Phase I, performers must demonstrate design and fabrication feasibility through modeling and simulation of an amplifier and a ring oscillator, while Phase II requires demonstrating an Analog-to-Digital Converter with a sampling rate exceeding 10,000 samples per second. Technical requirements include achieving a measured Direct Current gain exceeding 20 dB at 800 degrees Celsius in Phase I and maturing the fabrication process using at least 4-inch diameter wafers in Phase II. Proposals must be submitted by the application deadline of June 24, 2026, at 4:00 PM Eastern Time.