TEMPERATURE-HARDENED ELECTRONICS FOR RELIABLE MISSION-CRITICAL APPLICATIONS (THERMAL)
SBIR Opportunity Analysis
DARPA, within the Department of Defense, is seeking SBIR proposals to develop manufacturable mixed-signal integrated circuit technology that can operate reliably in extreme high-temperature environments up to 800°C. The effort focuses on a scalable wafer-based fabrication process for high-speed, thermally resilient electronics, with Phase I emphasizing feasibility through modeling and simulation and experimental validation of an amplifier and ring oscillator, and Phase II extending to an ADC demonstration and fabrication-process maturation. Key technical targets include verified amplifier performance at 800°C, a ring oscillator propagation delay below 500 ns, and later ADC performance at 800°C with more than 10,000 samples per second, 8-bit resolution, less than 1 W power, and SNR above 40 dB. The proposal deadline is June 24, 2026 at 4:00 PM UTC, and the solicitation number is DPA26BZ02-NV008.