TEMPERATURE-HARDENED ELECTRONICS FOR RELIABLE MISSION-CRITICAL APPLICATIONS (THERMAL)
SBIR Opportunity Analysis
DARPA, within the Department of Defense, is seeking SBIR proposals for temperature-hardened mixed-signal electronics that can operate reliably in extreme heat for mission-critical defense and dual-use applications. The work focuses on developing a manufacturable wafer-based fabrication process for high-speed mixed-signal ICs, including proof-of-concept design and fabrication approaches, with Phase I centered on feasibility through modeling, simulation, and preferred experimental validation. Key technical targets include an amplifier with more than 20 dB DC gain and over 1 MHz unity-gain bandwidth at 800°C, a ring oscillator with less than 500 ns propagation delay at 800°C, and in Phase II an ADC that operates stably at 800°C with more than 10,000 samples per second, 8-bit resolution, under 1 W power, and SNR above 40 dB while scaling fabrication through at least one 4-inch lot every six months. The solicitation is pre-release, opens May 27, 2026, and proposals are due June 24, 2026 at 4:00 PM UTC.