Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials
STTR Opportunity Analysis
DARPA, within the Department of Defense SBIR/STTR program, is seeking Direct to Phase II STTR proposals for a flexible, polymer-matrix thermal interface material for high-performance electronics and power applications. The work calls for a scalable biomanufactured, biocomposite filler-type TIM with tunable thermal and mechanical properties, prototype demonstration in an operational environment, and supporting commercialization and transition planning. Key technical targets include through-plane thermal conductivity above 23 W/m-K, stable performance after 1000 bending cycles at 100% maximum strain, sufficient adhesion, and elastomer-like flexibility, with collaboration from commercial and military end users and a technoeconomic analysis included. The base period runs 12 months with optional milestones through month 18, and the opportunity is pre-release under DPA26TZ03-DV002/26.TZ with an application deadline of July 22, 2026 at 4:00 PM ET.