STTRPre-Release

Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials

Solicitation ID26.TZ
Agency
DOD
DARPA
Deadline
Jul 22, 2026
49 days left
Posted Date
Jun 3, 2026
Classification
STTR
Phase: Phase II

STTR Opportunity Analysis

DARPA, within the Department of Defense SBIR/STTR program, is seeking Direct to Phase II STTR proposals for a flexible, polymer-matrix thermal interface material for high-performance electronics and power applications. The work calls for a scalable biomanufactured, biocomposite filler-type TIM with tunable thermal and mechanical properties, prototype demonstration in an operational environment, and supporting commercialization and transition planning. Key technical targets include through-plane thermal conductivity above 23 W/m-K, stable performance after 1000 bending cycles at 100% maximum strain, sufficient adhesion, and elastomer-like flexibility, with collaboration from commercial and military end users and a technoeconomic analysis included. The base period runs 12 months with optional milestones through month 18, and the opportunity is pre-release under DPA26TZ03-DV002/26.TZ with an application deadline of July 22, 2026 at 4:00 PM ET.

SBIR Documents

1 File

Related SBIR/STTR Opportunities

Opportunity Snapshot

Source SystemOfficial Link
Program Type
STTR - Phase II
Agency
DOD / DARPA

Key Dates

Release DateJun 3, 2026
Open DateJun 24, 2026
Application DueJul 22, 2026
Close DateJul 22, 2026